XC2VP2-6FGG256C

The XC2VP2-6FGG256C is a Virtex®-II Pro platform FPGA in a 256-ball BGA package, designed for commercial-grade embedded systems and high-performance prototyping. It combines programmable logic with on-chip memory and I/O resources to support a wide range of system functions where integration and flexible hardware implementation are required.

Built on the Virtex-II Pro architecture, the device targets applications that benefit from integrated logic, embedded memory, and a substantial I/O count, delivering a compact programmable solution with defined supply and thermal operating ranges for predictable integration into board-level designs.

Key Features

• Logic Resources — 352 CLBs and 3,168 logic elements provide the programmable fabric for custom digital logic and control functions.
• Embedded Memory — Approximately 0.22 Mbits (221,184 bits) of on-chip RAM to implement FIFOs, buffers, and small data stores directly in the FPGA.
• I/O Capacity — 140 user I/O pins to interface with sensors, peripherals, memory, and external logic at the board level.
• Core Architecture — Based on the Virtex-II Pro platform, which includes architecture-level features such as dedicated multiplier blocks and high-performance clock management circuitry documented for the family.
• Device-Level Capabilities — The Virtex-II Pro family specification references features like embedded processor block support (up to two IBM PowerPC RISC cores on some devices) and multi-gigabit transceiver options on select members of the family.
• Package and Mounting — 256-ball BGA in a 17 × 17 FBGA footprint (supplier package: 256-FBGA), optimized for surface-mount assembly.
• Power and Thermal — Core voltage supply range 1.425 V to 1.575 V and commercial operating temperature 0 °C to 85 °C for consistent system-level power and thermal planning.
• Compliance — RoHS compliant.

Typical Applications

• Embedded Processing — Implement custom control and preprocessing tasks where on-chip logic and memory reduce external component count and latency.
• Communications Prototyping — Use the Virtex-II Pro platform’s family-level transceiver and clocking features on compatible devices for evaluating serial links and telecom/datacom functions.
• Signal Processing and DSP Acceleration — Leverage dedicated multiplier blocks and embedded RAM to build pipelined arithmetic and buffering stages for real-time data paths.
• Board-Level Integration — High I/O count and compact 256-BGA package simplify system integration where PCB area and connector density are constrained.

Unique Advantages

• Balanced Logic and Memory Resources: 3,168 logic elements paired with approximately 0.22 Mbits of embedded RAM let designers implement control logic and local data buffering without excessive external memory.
• Ample I/O for System Interfaces: 140 I/O pins support diverse peripheral and bus interfaces, enabling broad connectivity on a single device.
• Compact, Surface-Mount Package: The 256-BGA (17 × 17 FBGA) footprint provides a high-density, manufacturable solution for modern PCB assembly.
• Defined Supply and Thermal Envelope: Narrow core voltage range (1.425 V–1.575 V) and commercial temperature grade (0 °C–85 °C) simplify power supply design and thermal planning for standard embedded applications.
• Platform-Level Capabilities: As a member of the Virtex-II Pro family, design teams can reference family features—such as embedded processor support and advanced clocking—to evaluate system architectures and scalability.
• RoHS Compliance: Environmentally compliant manufacturing and supply chain compatibility for commercial products.

Why Choose XC2VP2-6FGG256C?

The XC2VP2-6FGG256C provides a practical combination of programmable logic, embedded memory, and substantial I/O in a compact BGA package, making it suitable for commercial embedded designs and system prototyping. Its defined voltage and temperature ranges and RoHS compliance help streamline hardware validation and production planning.

Designers looking for a Virtex-II Pro family device with modest logic capacity and on-chip RAM will find this part useful where board area, I/O count, and integration are priorities. The family-level architecture also enables evaluation of embedded processing and transceiver capabilities when scaling to other Virtex-II Pro members.

Request a quote or submit a product inquiry to receive pricing, lead-time, and availability for the XC2VP2-6FGG256C. Our team will respond with the details needed to move your design forward.