XC2VP2-7FGG256C

The XC2VP2-7FGG256C is a Virtex‑II Pro Field Programmable Gate Array (FPGA) in a 256‑ball BGA package. It delivers a compact, surface‑mount FPGA solution with configurable logic, embedded memory, and a high I/O count suited for commercial embedded and communications applications.

As a member of the Virtex‑II Pro platform, the device aligns with a family that supports high‑performance FPGA architectures and platform‑level features. This part offers a balance of logic capacity, on‑chip memory and I/O density for design integration and prototyping in commercial temperature environments.

Key Features

• Logic Capacity — 3,168 logic elements organized across 352 configurable logic blocks (CLBs) to implement custom logic and control functions.
• Embedded Memory — Approximately 0.22 Mbits of on‑chip RAM (221,184 total RAM bits) for data buffering, FIFOs and local storage.
• I/O Density — 140 user I/O pins to interface with peripherals, sensors and board‑level signalling.
• Package & Mounting — 256‑FBGA (17×17) package in a surface‑mount form factor for high‑density PCB assemblies.
• Power Supply — Core supply range from 1.425 V to 1.575 V to match board power rails and system design constraints.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS‑compliant construction for lead‑free manufacturing processes.
• Platform Capabilities — Part of the Virtex‑II Pro family, which includes platform features such as advanced clock management, dedicated multiplier blocks and platform IP support as described in the Virtex‑II Pro documentation.

Typical Applications

• Communications & Networking — Implement protocol processing, packet buffering and interface bridging where compact FPGA logic and moderate embedded memory are required.
• Embedded Systems & Prototyping — Use as a platform for embedded logic development, hardware acceleration and system validation in commercial products.
• Data Acquisition & Control — Manage I/O aggregation, timing control and on‑chip buffering for measurement and control applications operating within commercial temperature limits.
• High‑Speed Serial and Interface Tasks — Leverage the Virtex‑II Pro platform features for designs that require advanced I/O and platform IP (refer to the Virtex‑II Pro documentation for family‑level transceiver and processor block capabilities).

Unique Advantages

• Compact, High‑Density Package: 256‑FBGA (17×17) delivers a small PCB footprint for space‑constrained designs while providing 140 I/O for flexible board interfacing.
• Balanced Logic and Memory: 3,168 logic elements and approximately 0.22 Mbits of embedded RAM support a variety of control, buffering and medium‑complexity datapath tasks without external memory.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation for reliable performance in indoor and commercial environments.
• Platform Ecosystem: Being part of the Virtex‑II Pro family provides access to family documentation and platform features that aid integration and IP reuse.
• Manufacturing Friendly: Surface‑mount 256‑FBGA package and RoHS compliance align with modern board assembly and environmental requirements.
• Defined Power Envelope: Narrow core supply range (1.425 V–1.575 V) simplifies power rail design and sequencing planning.

Why Choose XC2VP2-7FGG256C?

The XC2VP2-7FGG256C offers a practical combination of logic resources, embedded RAM and I/O density in a compact 256‑FBGA package for commercial embedded and communications designs. Its specification set supports designers looking for a platform‑level FPGA with clear, verifiable hardware characteristics and RoHS compliance.

This device is appropriate for engineering teams developing medium‑complexity digital systems, prototyping embedded functions, or integrating moderate buffering and control logic where commercial temperature operation and a compact BGA package are required.

Request a quote or submit an inquiry to receive pricing and availability for the XC2VP2-7FGG256C.