XC2VP20-5FF896I

The XC2VP20-5FF896I is a Virtex®-II Pro platform Field Programmable Gate Array (FPGA) in a 896-ball flip-chip BGA package. It delivers a balance of programmable logic, on-chip memory, and a high I/O count for system-level integration in industrial applications.

Built on the Virtex-II Pro platform, the device targets designs that require substantial logic resources, embedded RAM for buffering and storage, and extensive external interfacing while operating across a wide industrial temperature range.

Key Features

• Core & Architecture  Based on the Virtex-II Pro FPGA platform; the family-level specification includes support for features such as embedded processor blocks and RocketIO multi-gigabit transceiver technology.
• Logic Resources  Contains 2,320 configurable logic blocks (CLBs) corresponding to approximately 20,880 logic elements for implementing medium-complexity logic and control functions.
• Embedded Memory  Approximately 1.622 Mbits of on-chip RAM to support frame buffering, FIFOs, and local storage for data-path and control logic.
• I/O Capacity  556 user I/O pins to accommodate broad peripheral and interface requirements without reliance on external multiplexer logic.
• Package & Mounting  896-ball flip-chip BGA (896-FCBGA, 31×31) package designed for surface-mount assembly and dense PCB implementations.
• Power  Core supply operating range of 1.425 V to 1.575 V for precise power budgeting and regulator selection.
• Operating Temperature  Rated for industrial operation from −40°C to 100°C to support deployment in demanding environments.
• Grade  Industrial grade device intended for applications requiring broader temperature tolerance and environmental robustness.
• SRAM-Based In-System Configuration  Platform-level features include SRAM-based in-system configuration and flexible logic resources for iterative development and field updates.

Typical Applications

• Embedded processing and control  Use the device for system controllers and embedded processing tasks where on-chip logic and memory accelerate control loops and data handling.
• Telecom and datacom systems  Leverage the Virtex-II Pro platform’s multi-gigabit transceiver support (family-level) for high-bandwidth serial links and protocol processing.
• High-density I/O interfacing  Ideal for designs that require many external interfaces—industrial I/O aggregation, sensor arrays, or board-level bridges benefit from 556 I/Os.
• Prototyping and platform development  Suitable for developers implementing medium-complexity FPGA designs that require reprogrammability and ample on-chip RAM for validation.

Unique Advantages

• Substantial logic capacity: Approximately 20,880 logic elements and 2,320 CLBs support complex finite-state machines, datapaths, and control logic without excessive partitioning.
• Significant embedded RAM: Approximately 1.622 Mbits of on-chip memory reduces dependency on external RAM for buffering and temporary storage.
• High I/O count: 556 user I/Os simplify integration with peripherals, sensors, and external logic, lowering the need for extra interface components.
• Industrial temperature rating: −40°C to 100°C qualification supports deployment in thermally demanding or outdoor installations.
• Compact, high-density package: 896-FCBGA (31×31) provides a small footprint for space-constrained board designs while enabling high pin-count routing.
• Platform-level extensibility: Virtex-II Pro platform features (such as PowerPC processor block support and RocketIO transceivers at the family level) provide options for system expansion and advanced interfaces.

Why Choose XC2VP20-5FF896I?

The XC2VP20-5FF896I combines a Virtex-II Pro platform architecture with a strong complement of logic elements, embedded RAM, and one of the higher I/O counts available in its package class. Its industrial temperature rating and compact 896-FCBGA package make it suitable for integrated designs that must balance logic density and board-level connectivity.

This device is well suited to engineers and system designers who need a reprogrammable platform with ample on-chip memory and I/O for telecom/datacom interfaces, embedded control, and complex prototyping tasks while maintaining industrial temperature operation.

Request a quote or submit an availability inquiry for XC2VP20-5FF896I to receive pricing and lead-time information for your design planning.