XC2VP20-5FFG1152C
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 564 1622016 20880 1152-BBGA, FCBGA |
|---|---|
| Quantity | 284 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2320 | Number of Logic Elements/Cells | 20880 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1622016 |
Overview of XC2VP20-5FFG1152C – Virtex®-II Pro Field Programmable Gate Array (FPGA)
The XC2VP20-5FFG1152C is a Virtex®-II Pro FPGA device delivering a flexible, SRAM-based programmable fabric for commercial electronic systems. The device combines a high logic capacity with substantial embedded memory and a large I/O count to support complex digital designs requiring dense integration and system-level interfacing.
Architected for platform-style designs, this Virtex®-II Pro member targets applications that benefit from on-chip processing elements, multi-gigabit serial support at the family level, and extensive programmable resources while operating within a commercial temperature range.
Key Features
- Core Architecture Virtex®-II Pro FPGA family device with SRAM-based in-system programmability and platform-oriented feature set as defined in the product family datasheet.
- Logic Capacity Approximately 20,880 logic elements to implement complex combinational and sequential logic functions.
- Embedded Memory Approximately 1.6 Mbits of on-chip RAM (1,622,016 total RAM bits) for FIFOs, buffers and local storage.
- I/O Density 564 user I/O pins to support broad interface requirements and dense board-level connectivity.
- Package & Mounting 1152-ball Flip-Chip Ball Grid Array (1152-FCBGA, 35 × 35) package, surface-mount mounting.
- Supply Voltage Core supply range 1.425 V to 1.575 V, enabling controlled power planning and board-level design.
- Operating Temperature & Grade Commercial grade device rated for 0 °C to 85 °C operation.
- Family-Level Processing & Transceivers The Virtex®-II Pro family specification documents include embedded processor block support (PowerPC™ 405) and RocketIO multi-gigabit transceiver technology where applicable to family members.
- Standards & Compliance RoHS-compliant to support lead-free assembly and environmental compliance initiatives.
Typical Applications
- Embedded Systems with On-Chip Processing Use cases leveraging the Virtex®-II Pro family’s embedded processor block support for system-level integration and offload of control tasks.
- High-Performance Communications Designs that require multi-gigabit serial interfaces at the family capability level (RocketIO/ RocketIO X) for telecom and datacom links.
- DSP and Signal Processing FPGA-based data path implementations utilizing the device’s logic elements and embedded RAM for packet buffering, filtering and parallel processing.
- Prototyping and Platform Development System platforms and proof-of-concept designs needing reconfigurable logic, substantial I/O and on-chip memory for iterative development.
Unique Advantages
- High Integration: Consolidates logic, embedded RAM and a large I/O count in a single 1152-FCBGA package to reduce external components and board area.
- Substantial Logic Resources: Roughly 20,880 logic elements enable implementation of complex finite-state machines, custom processors and coprocessor logic.
- Large On-Chip Memory: Approximately 1.6 Mbits of embedded memory supports deep buffering and memory-intensive algorithms without immediate external RAM.
- Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to meet a wide range of commercial-grade application environments.
- Family-Level System Capabilities: Access to Virtex®-II Pro family features such as embedded processor cores and multi-gigabit transceivers for system-centric designs.
- RoHS Compliant: Supports lead-free manufacturing and environmental compliance requirements.
Why Choose XC2VP20-5FFG1152C?
The XC2VP20-5FFG1152C provides a balanced combination of programmable logic capacity, embedded memory, and a high I/O count in a commercial-grade Virtex®-II Pro package. It is suited for designers building platform-style systems that require flexible, in-system reconfigurability alongside family-level processor and transceiver capabilities.
Choose this device when you need a proven FPGA platform with substantial on-chip resources, dense interfacing, and RoHS compliance for commercial electronic products where scalability and integration matter.
Request a quote or submit a procurement inquiry today to discuss availability and pricing for XC2VP20-5FFG1152C.

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