XC2VP20-5FFG1152C

IC FPGA 564 I/O 1152FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 564 1622016 20880 1152-BBGA, FCBGA

Quantity 284 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2320Number of Logic Elements/Cells20880
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1622016

Overview of XC2VP20-5FFG1152C – Virtex®-II Pro Field Programmable Gate Array (FPGA)

The XC2VP20-5FFG1152C is a Virtex®-II Pro FPGA device delivering a flexible, SRAM-based programmable fabric for commercial electronic systems. The device combines a high logic capacity with substantial embedded memory and a large I/O count to support complex digital designs requiring dense integration and system-level interfacing.

Architected for platform-style designs, this Virtex®-II Pro member targets applications that benefit from on-chip processing elements, multi-gigabit serial support at the family level, and extensive programmable resources while operating within a commercial temperature range.

Key Features

  • Core Architecture  Virtex®-II Pro FPGA family device with SRAM-based in-system programmability and platform-oriented feature set as defined in the product family datasheet.
  • Logic Capacity  Approximately 20,880 logic elements to implement complex combinational and sequential logic functions.
  • Embedded Memory  Approximately 1.6 Mbits of on-chip RAM (1,622,016 total RAM bits) for FIFOs, buffers and local storage.
  • I/O Density  564 user I/O pins to support broad interface requirements and dense board-level connectivity.
  • Package & Mounting  1152-ball Flip-Chip Ball Grid Array (1152-FCBGA, 35 × 35) package, surface-mount mounting.
  • Supply Voltage  Core supply range 1.425 V to 1.575 V, enabling controlled power planning and board-level design.
  • Operating Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
  • Family-Level Processing & Transceivers  The Virtex®-II Pro family specification documents include embedded processor block support (PowerPC™ 405) and RocketIO multi-gigabit transceiver technology where applicable to family members.
  • Standards & Compliance  RoHS-compliant to support lead-free assembly and environmental compliance initiatives.

Typical Applications

  • Embedded Systems with On-Chip Processing  Use cases leveraging the Virtex®-II Pro family’s embedded processor block support for system-level integration and offload of control tasks.
  • High-Performance Communications  Designs that require multi-gigabit serial interfaces at the family capability level (RocketIO/ RocketIO X) for telecom and datacom links.
  • DSP and Signal Processing  FPGA-based data path implementations utilizing the device’s logic elements and embedded RAM for packet buffering, filtering and parallel processing.
  • Prototyping and Platform Development  System platforms and proof-of-concept designs needing reconfigurable logic, substantial I/O and on-chip memory for iterative development.

Unique Advantages

  • High Integration: Consolidates logic, embedded RAM and a large I/O count in a single 1152-FCBGA package to reduce external components and board area.
  • Substantial Logic Resources: Roughly 20,880 logic elements enable implementation of complex finite-state machines, custom processors and coprocessor logic.
  • Large On-Chip Memory: Approximately 1.6 Mbits of embedded memory supports deep buffering and memory-intensive algorithms without immediate external RAM.
  • Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to meet a wide range of commercial-grade application environments.
  • Family-Level System Capabilities: Access to Virtex®-II Pro family features such as embedded processor cores and multi-gigabit transceivers for system-centric designs.
  • RoHS Compliant: Supports lead-free manufacturing and environmental compliance requirements.

Why Choose XC2VP20-5FFG1152C?

The XC2VP20-5FFG1152C provides a balanced combination of programmable logic capacity, embedded memory, and a high I/O count in a commercial-grade Virtex®-II Pro package. It is suited for designers building platform-style systems that require flexible, in-system reconfigurability alongside family-level processor and transceiver capabilities.

Choose this device when you need a proven FPGA platform with substantial on-chip resources, dense interfacing, and RoHS compliance for commercial electronic products where scalability and integration matter.

Request a quote or submit a procurement inquiry today to discuss availability and pricing for XC2VP20-5FFG1152C.

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