XC2VP20-5FF896C
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 556 1622016 20880 896-BBGA, FCBGA |
|---|---|
| Quantity | 1,385 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FCBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 556 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2320 | Number of Logic Elements/Cells | 20880 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1622016 |
Overview of XC2VP20-5FF896C – Virtex®-II Pro FPGA, 896-FCBGA, Commercial
The XC2VP20-5FF896C is a Virtex®-II Pro field programmable gate array (FPGA) in an 896-ball flip-chip BGA (FCBGA) package. As a member of the Virtex-II Pro family, the device combines a large logic fabric with embedded system features suitable for designs that require on-chip processors, multi-gigabit serial connectivity, and substantial I/O capacity.
Designed for commercial-grade applications, the device offers a balance of logic capacity, embedded memory, and flexible I/O in a surface-mount FCBGA package, with supply and thermal specifications suitable for standard commercial deployments.
Key Features
- Logic Capacity Approximately 20,880 logic elements to implement complex custom logic and control functions.
- On-chip Memory Approximately 1.62 Mbits of embedded RAM for buffering, packet storage, and DSP data paths.
- I/O Density 556 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
- Embedded Processing and Transceivers (Family-Level) Virtex-II Pro family features include embedded processor blocks (PowerPC™ cores) and RocketIO multi-gigabit transceiver support as documented in the device family specification.
- Dedicated DSP Resources The family specification includes dedicated 18-bit × 18-bit multiplier blocks for signal processing and arithmetic acceleration.
- Clock and I/O Technology High-performance clock management circuitry and SelectI/O-Ultra / digitally controlled impedance (DCI) I/O are listed in the family documentation to support diverse I/O signaling requirements.
- Package and Mounting 896-FCBGA (31 × 31 mm) flip-chip BGA package, surface-mount mounting type for compact board integration.
- Power and Temperature Core supply range of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C.
- RoHS Compliance Device is RoHS compliant.
Typical Applications
- Embedded processing platforms Use the family’s embedded processor block support to integrate control and application code directly on-chip.
- High-speed communications Leverage the family-level multi-gigabit transceiver capabilities for serial link implementations and protocol bridging.
- DSP and signal processing Combine the on-chip RAM and dedicated multipliers for filtering, transformation, and real-time data processing tasks.
- Interface aggregation and bridging High I/O count and flexible logic resources allow consolidation of multiple peripheral interfaces and custom protocol logic.
Unique Advantages
- High logic density: The device’s ~20,880 logic elements enable substantial custom logic integration without external ASICs or glue logic.
- Significant on-chip memory and DSP support: Approximately 1.62 Mbits of embedded RAM together with dedicated multiplier blocks streamline implementation of buffer-heavy and compute-intensive functions.
- Extensive I/O count: 556 I/O pins provide design flexibility for parallel interfaces, memory buses, and mixed-signal front ends.
- Commercial-grade readiness: Specified 0 °C to 85 °C operating range and RoHS compliance simplify procurement and deployment for commercial products.
- Compact board integration: 896-ball FCBGA package (31 × 31 mm) supports high-density PCB designs and surface-mount assembly.
- Family-level system features: Virtex-II Pro family documentation lists embedded processors, RocketIO transceivers, and clock management resources that help accelerate system-level design.
Why Choose XC2VP20-5FF896C?
The XC2VP20-5FF896C provides a compelling combination of logic capacity, embedded memory, and I/O density in a commercial-grade Virtex-II Pro FPGA package. It is suited for designs that need integrated processing elements, significant DSP resources, and high pin counts while maintaining a compact surface-mount footprint.
Supported by the Virtex-II Pro family documentation and associated IP/core references, this device is appropriate for engineering teams implementing embedded processing, communications interfaces, and complex custom logic where on-chip resources reduce system complexity and board-level component count.
Request a quote or submit a quote to get availability and pricing for the XC2VP20-5FF896C. Our team can provide further technical details and support for integration into your design.

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