XC2VP20-5FF896C

IC FPGA 556 I/O 896FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 556 1622016 20880 896-BBGA, FCBGA

Quantity 1,385 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package896-FCBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BBGA, FCBGANumber of I/O556Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2320Number of Logic Elements/Cells20880
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1622016

Overview of XC2VP20-5FF896C – Virtex®-II Pro FPGA, 896-FCBGA, Commercial

The XC2VP20-5FF896C is a Virtex®-II Pro field programmable gate array (FPGA) in an 896-ball flip-chip BGA (FCBGA) package. As a member of the Virtex-II Pro family, the device combines a large logic fabric with embedded system features suitable for designs that require on-chip processors, multi-gigabit serial connectivity, and substantial I/O capacity.

Designed for commercial-grade applications, the device offers a balance of logic capacity, embedded memory, and flexible I/O in a surface-mount FCBGA package, with supply and thermal specifications suitable for standard commercial deployments.

Key Features

  • Logic Capacity  Approximately 20,880 logic elements to implement complex custom logic and control functions.
  • On-chip Memory  Approximately 1.62 Mbits of embedded RAM for buffering, packet storage, and DSP data paths.
  • I/O Density  556 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
  • Embedded Processing and Transceivers (Family-Level)  Virtex-II Pro family features include embedded processor blocks (PowerPC™ cores) and RocketIO multi-gigabit transceiver support as documented in the device family specification.
  • Dedicated DSP Resources  The family specification includes dedicated 18-bit × 18-bit multiplier blocks for signal processing and arithmetic acceleration.
  • Clock and I/O Technology  High-performance clock management circuitry and SelectI/O-Ultra / digitally controlled impedance (DCI) I/O are listed in the family documentation to support diverse I/O signaling requirements.
  • Package and Mounting  896-FCBGA (31 × 31 mm) flip-chip BGA package, surface-mount mounting type for compact board integration.
  • Power and Temperature  Core supply range of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • Embedded processing platforms  Use the family’s embedded processor block support to integrate control and application code directly on-chip.
  • High-speed communications  Leverage the family-level multi-gigabit transceiver capabilities for serial link implementations and protocol bridging.
  • DSP and signal processing  Combine the on-chip RAM and dedicated multipliers for filtering, transformation, and real-time data processing tasks.
  • Interface aggregation and bridging  High I/O count and flexible logic resources allow consolidation of multiple peripheral interfaces and custom protocol logic.

Unique Advantages

  • High logic density: The device’s ~20,880 logic elements enable substantial custom logic integration without external ASICs or glue logic.
  • Significant on-chip memory and DSP support: Approximately 1.62 Mbits of embedded RAM together with dedicated multiplier blocks streamline implementation of buffer-heavy and compute-intensive functions.
  • Extensive I/O count: 556 I/O pins provide design flexibility for parallel interfaces, memory buses, and mixed-signal front ends.
  • Commercial-grade readiness: Specified 0 °C to 85 °C operating range and RoHS compliance simplify procurement and deployment for commercial products.
  • Compact board integration: 896-ball FCBGA package (31 × 31 mm) supports high-density PCB designs and surface-mount assembly.
  • Family-level system features: Virtex-II Pro family documentation lists embedded processors, RocketIO transceivers, and clock management resources that help accelerate system-level design.

Why Choose XC2VP20-5FF896C?

The XC2VP20-5FF896C provides a compelling combination of logic capacity, embedded memory, and I/O density in a commercial-grade Virtex-II Pro FPGA package. It is suited for designs that need integrated processing elements, significant DSP resources, and high pin counts while maintaining a compact surface-mount footprint.

Supported by the Virtex-II Pro family documentation and associated IP/core references, this device is appropriate for engineering teams implementing embedded processing, communications interfaces, and complex custom logic where on-chip resources reduce system complexity and board-level component count.

Request a quote or submit a quote to get availability and pricing for the XC2VP20-5FF896C. Our team can provide further technical details and support for integration into your design.

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