XC2VP20-5FFG1152I

The XC2VP20-5FFG1152I is an industrial-grade Virtex®-II Pro field programmable gate array (FPGA) offered in a 1152-ball flip-chip BGA (1152-FCBGA, 35×35) package. The device integrates a large FPGA fabric with plentiful I/O and on-chip resources geared for embedded processing and high-bandwidth system functions.

With 2,320 configurable logic blocks, 20,880 logic elements, approximately 1.622 Mbits of embedded memory and 564 user I/O, this device targets applications that require dense logic, substantial on-chip RAM, and extensive external connectivity, while operating across an industrial temperature range.

Key Features

• Logic and Fabric  2,320 configurable logic blocks (CLBs) and 20,880 logic elements provide a sizable programmable fabric for complex digital logic and custom system functions.
• Embedded Memory  Approximately 1.622 Mbits of on-chip RAM for packet buffering, state storage and local data processing.
• High I/O Count  564 user I/O pins support broad interfacing options for parallel buses, high-pin-count peripherals and board-level connectivity.
• On-Chip Processing and Transceivers  Virtex-II Pro family features include up to two PowerPC™ 405 processor blocks and embedded RocketIO/RocketIO X multi-gigabit transceivers for integrated processing and serial link capability.
• DSP and Arithmetic Resources  Dedicated 18-bit × 18-bit multiplier blocks provide hardware acceleration for DSP and arithmetic-heavy functions.
• Clocking and I/O Technology  Integrated clock management circuitry (including DCM) and SelectI/O™-Ultra / DCI I/O features, as documented for the Virtex-II Pro family, support precise clocking and signal conditioning.
• Package and Mounting  1152-ball flip-chip BGA (1152-FCBGA, 35×35) in a surface-mount form factor for high-density board designs.
• Power and Temperature  Supported core supply voltage range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C suitable for industrial environments.
• Compliance  RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• Embedded Processing  Integration of on-chip processor blocks with programmable logic for control, protocol handling and system management tasks.
• High-Speed Communications  Use of RocketIO/RocketIO X transceivers (family feature) and abundant I/O for telecom and datacom interfaces and high-bandwidth serial links.
• Signal Processing and Acceleration  Dedicated multiplier blocks and ample embedded RAM enable DSP algorithms, filtering and real-time data processing.
• Complex System Integration  Large logic capacity and high I/O count allow consolidation of multiple board-level functions into a single FPGA-based system component.

Unique Advantages

• Integrated Processing and Logic: On-chip processor blocks (family feature) combined with FPGA fabric reduce external component count and simplify embedded system architectures.
• High Connectivity: 564 user I/O and support for multi-gigabit transceivers enable versatile interfacing to a wide range of peripherals and high-speed links.
• Substantial Local Memory: Approximately 1.622 Mbits of embedded RAM supports buffering and local data storage without relying on external memory for many functions.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation, suitable for industrial deployments where extended temperature tolerance is required.
• RoHS Compliant: Conforms to RoHS requirements to support modern, lead-free manufacturing processes.
• High-Density Package: 1152-FCBGA packaging provides a compact, high-pin-count solution for complex, space-constrained board designs.

Why Choose XC2VP20-5FFG1152I?

The XC2VP20-5FFG1152I combines a large programmable fabric, substantial embedded memory and an extensive I/O complement in a single industrial-grade package. It is positioned for engineers who need integrated processing capability, high I/O density and the potential for multi-gigabit serial interfaces within a compact flip-chip BGA footprint.

This device is suitable for designs that require consolidated functionality—reducing bill of materials and board complexity—while providing the performance and configurability inherent to the Virtex-II Pro family. Its operating voltage, temperature range and RoHS compliance make it a pragmatic choice for industrial applications that demand reliable, long-life FPGA solutions.

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