XC2VP20-5FFG896I

The XC2VP20-5FFG896I is a Virtex®-II Pro family field programmable gate array (FPGA) in a 896‑ball flip‑chip BGA (31×31) package. It provides a high-density, SRAM‑based programmable fabric with 2,320 configurable logic blocks (CLBs) and 20,880 logic elements for complex digital logic implementation. With 556 user I/O pins and approximately 1.622 Mbits of on‑chip memory, this device targets industrial applications that require substantial I/O connectivity and embedded memory.

Key Features

• Logic Capacity  2,320 configurable logic blocks (CLBs) delivering 20,880 logic elements for implementing medium to large custom logic functions.
• Embedded Memory  Approximately 1.622 Mbits of on‑chip RAM to support buffering, lookup tables, and local data storage.
• I/O and Package  556 user I/Os in a 896‑BBGA (896‑FCBGA, 31×31) surface‑mount package to support dense external interfacing and board-level routing.
• Power Supply  Core supply range of 1.425 V to 1.575 V for predictable power budgeting and system integration.
• Operating Range  Industrial operating temperature from −40 °C to 100 °C suitable for a broad range of rugged and industrial environments.
• Package and Mounting  Surface mount 896‑FCBGA (31×31) package optimized for compact, high‑pin‑count board designs.
• Compliance  RoHS compliant, supporting environmental and regulatory requirements for lead‑free assemblies.
• Virtex‑II Pro Family Capabilities (per datasheet)  The Virtex‑II Pro platform includes architectural features such as embedded processor block support, Multi‑Gigabit transceiver options, SelectRAM resources, and dedicated multiplier blocks—useful when designing systems that leverage the family’s integrated capabilities.

Typical Applications

• Industrial Control  Implement real‑time control logic, sensor aggregation, and protocol bridging using the device’s substantial logic capacity and broad I/O count.
• Communications Infrastructure  Use the on‑chip memory and high I/O density to build packet buffering, protocol handling, and custom interface logic for network equipment.
• High‑Density I/O Systems  Leverage 556 I/Os and the 896‑FCBGA package for applications that require many external connections in a compact form factor.
• Embedded System Prototyping  Prototype and validate system architectures that need reprogrammable logic with significant local memory resources and CLB capacity.

Unique Advantages

• Substantial Logic Resources:  20,880 logic elements and 2,320 CLBs enable mapping of complex finite state machines, datapaths, and control logic without immediate partitioning across multiple devices.
• Generous I/O Count:  556 user I/Os provide flexibility to attach multiple peripherals, parallel interfaces, and custom connectors directly to the FPGA fabric.
• On‑Chip Memory for Local Storage:  Approximately 1.622 Mbits of embedded RAM reduces external memory dependency for buffering and temporary data storage, simplifying board layout and BOM.
• Industrial Temperature Range:  Rated for −40 °C to 100 °C operation to support deployment in demanding environments where broader temperature tolerance is required.
• Compact, High‑Pin‑Count Package:  The 896‑FCBGA (31×31) offers high routing density in a condensed footprint suitable for space‑constrained designs.
• RoHS Compliant:  Meets lead‑free assembly requirements to simplify regulatory compliance for modern electronics manufacturing.

Why Choose XC2VP20-5FFG896I?

The XC2VP20-5FFG896I positions itself as a capable Virtex®‑II Pro family member for designs that require a balance of logic capacity, embedded memory, and extensive I/O in a compact BGA package. Its combination of 20,880 logic elements, roughly 1.622 Mbits of on‑chip RAM, and 556 I/Os makes it suitable for industrial systems, communications equipment, and high‑density interface applications.

Designed for engineers who need reprogrammable, scalable hardware building blocks, this FPGA provides a platform for consolidating functions, reducing board complexity, and accelerating time‑to‑market while maintaining environmental compliance and broad operating temperature support.

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