XC2VP20-5FG676I

IC FPGA 404 I/O 676FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 404 1622016 20880 676-BGA

Quantity 1,775 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BGANumber of I/O404Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2320Number of Logic Elements/Cells20880
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1622016

Overview of XC2VP20-5FG676I – Virtex®-II Pro FPGA, 676-BGA, Industrial Grade

The XC2VP20-5FG676I is a Virtex®-II Pro field programmable gate array supplied by AMD. It is built on the Virtex-II Pro platform FPGA architecture and provides a combination of programmable logic, embedded memory, and high-density I/O suitable for industrial embedded and communications designs.

This device delivers 2320 CLBs and 20,880 logic elements, approximately 1.62 Mbits of embedded memory, and 404 user I/O in a 676-ball BGA package. It is specified for industrial operation and RoHS compliant.

Key Features

  • Core Logic 2320 configurable logic blocks (CLBs) and 20,880 logic elements provide the programmable fabric for custom logic, control, and glue functions.
  • Embedded Memory Approximately 1.62 Mbits of on-chip RAM to support buffering, FIFOs, and intermediate storage for DSP and packet processing tasks.
  • I/O Density 404 user I/O pins support high channel counts and flexible board-level interfacing in a compact package.
  • Platform Capabilities Built on the Virtex-II Pro family architecture, which includes platform-level features such as RocketIO multi-gigabit transceivers and optional PowerPC 405 processor blocks (family features as described in product documentation).
  • Package & Mounting 676-FBGA (27×27) BGA package, surface-mountable for dense board layouts and reliable solder joints.
  • Power & Supply Core supply range specified at 1.425 V to 1.575 V to match target system power rails.
  • Industrial Temperature Range Specified for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Compliance RoHS compliant to support environmentally conscious manufacturing and end products.

Typical Applications

  • Telecom & Datacom: Use in high-speed communication systems leveraging the Virtex-II Pro platform’s multi-gigabit transceiver capabilities as described in product documentation.
  • Embedded Processing Systems: Integration of programmable logic with platform-level processor blocks enables embedded control, protocol handling, and system offload tasks.
  • Signal Processing & DSP: On-chip RAM and dedicated arithmetic resources in the Virtex-II Pro family support buffering and real-time processing for signal chains.
  • Industrial Control & Automation: Industrial temperature rating and high I/O count allow deployment in factory automation, motor control interface, and sensor aggregation applications.

Unique Advantages

  • High Logic Capacity: 20,880 logic elements and 2320 CLBs enable complex system integration and consolidation of multiple functions into a single device.
  • Substantial On-Chip Memory: Approximately 1.62 Mbits of embedded RAM reduces external memory dependence for many control and buffering tasks.
  • Dense I/O in a Compact Package: 404 user I/O in a 676-FBGA (27×27) form factor allows high channel counts while keeping board area manageable.
  • Industrial-Grade Operation: Specified −40 °C to 100 °C operating range supports deployment in demanding environmental conditions.
  • Platform-Level Flexibility: As a member of the Virtex-II Pro family, it leverages platform features documented for RocketIO transceivers and processor integration to meet system-level requirements.
  • Regulatory & Assembly Friendly: Surface-mount BGA packaging and RoHS compliance simplify modern manufacturing and environmental compliance.

Why Choose XC2VP20-5FG676I?

The XC2VP20-5FG676I offers a balanced combination of programmable logic, embedded memory, and high I/O density in an industrial-grade package. Its Virtex-II Pro platform roots provide access to family-level capabilities such as multi-gigabit transceivers and embedded processor blocks, enabling integration of communication, control, and signal processing functions into a single FPGA-based solution.

This device is well suited for engineering teams designing industrial embedded systems, communications equipment, and DSP-forward applications that require a robust, high-density FPGA with defined supply and thermal specifications. The combination of on-chip resources, packaging, and compliance attributes supports scalable, manufacturable designs.

Request a quote or submit an inquiry for pricing and availability to evaluate the XC2VP20-5FG676I for your next design.

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