XC2VP20-6FF1152C

The XC2VP20-6FF1152C is a Virtex®-II Pro platform FPGA from AMD, designed for high-density, configurable logic and system integration. It provides a balanced combination of logic capacity, embedded memory, and I/O resources for complex embedded or communications-focused designs.

Engineered for commercial-grade applications, this surface-mount FCBGA device offers substantial on-chip resources and packaging suited for space-constrained boards where high I/O count and system-level integration matter.

Key Features

• Logic Capacity — Approximately 20,880 logic elements to implement complex custom logic, state machines, and hardware accelerators.
• Embedded Memory — Approximately 1.62 Mbits of on-chip RAM, enabling local buffering, lookup tables, and small data stores without external memory.
• I/O Density — 564 user I/Os to support wide parallel interfaces, multiple channel connectivity, and high-pin-count peripherals.
• Virtex-II Pro Family Capabilities — As part of the Virtex-II Pro family, this device benefits from platform features described in the family datasheet, including support for RocketIO multi-gigabit transceivers and integrated processor block options on family members.
• Package & Mounting — 1152-ball FCBGA package (35 × 35 mm footprint) optimized for surface-mount assembly in compact, high-density boards.
• Power Supply — Core supply range of 1.425 V to 1.575 V for predictable power-domain design and supply planning.
• Operating Range & Grade — Commercial temperature range of 0 °C to 85 °C; suitable for standard commercial embedded applications.
• Environmental Compliance — RoHS compliant to meet modern assembly and regulatory requirements.

Typical Applications

• High-speed Communications — Deploy where multi-gigabit serial links and dense I/O are required; the Virtex-II Pro family supports RocketIO transceiver technology for telecom/datacom use cases.
• Embedded Processing Platforms — Ideal for systems that integrate FPGA fabric with processor cores (family-level PowerPC blocks) for control, protocol offload, or system orchestration.
• Custom Signal Processing & Acceleration — Use the device’s logic capacity and on-chip memory for deterministic hardware acceleration, DSP tasks, and real-time data handling.

Unique Advantages

• High Integration Density: Large logic element count and substantial embedded memory reduce reliance on external components and simplify board-level design.
• Extensive I/O Support: 564 I/Os provide flexibility for parallel interfaces, high-pin-count peripherals, and multi-channel connectivity without external multiplexing.
• Compact, High-Performance Package: 1152-FCBGA (35×35) package enables dense routing and compact system layouts while supporting surface-mount assembly.
• Predictable Power Domain: Narrow core voltage range (1.425–1.575 V) simplifies power-supply design and margining.
• Regulatory-Friendly: RoHS compliance supports environmentally conscious manufacturing and supply-chain requirements.

Why Choose XC2VP20-6FF1152C?

XC2VP20-6FF1152C delivers a combination of substantial logic resources, embedded memory, and high I/O density in a compact FCBGA package for commercial embedded designs. As a member of the Virtex-II Pro family, it aligns with platform-level capabilities aimed at system integration and high-speed communications.

This device is well suited to engineers and teams building complex, board-level systems that require configurable hardware acceleration, extensive I/O connectivity, and support for family-level transceiver and processor features. Its RoHS compliance and standard commercial temperature rating make it a practical choice for production systems in conventional commercial environments.

Request a quote or submit an inquiry for XC2VP20-6FF1152C to get pricing and availability tailored to your design and production needs.