XC2VP20-6FF896I

The XC2VP20-6FF896I is a Virtex®-II Pro platform Field Programmable Gate Array (FPGA) offered in an 896-ball flip-chip BGA (896-FCBGA, 31×31) package for surface-mount assembly. This device provides a balanced combination of logic density, embedded memory, and high I/O count for system-level integration in industrial applications.

Designed for applications that require flexible, programmable hardware, the device operates from a core supply of 1.425 V to 1.575 V and supports an operating temperature range of -40 °C to 100 °C. The Virtex-II Pro family datasheet also documents platform-level capabilities such as embedded processor blocks and high-performance transceiver and clocking resources.

Key Features

• Logic Resources  2320 configurable CLBs and 20,880 logic elements provide substantial on-chip logic capacity for complex FPGA designs.
• Embedded Memory  Approximately 1.62 Mbits of on-chip RAM (1,622,016 total RAM bits) for data buffering, packet storage, and local lookup tables.
• I/O Capacity  556 user-accessible I/O pins to support wide parallel interfaces and dense peripheral connectivity.
• Package & Mounting  896-FCBGA (31×31) flip-chip BGA package, optimized for surface-mount PCB assembly and high-density board layouts.
• Power  Core voltage range of 1.425 V to 1.575 V for predictable supply planning and power budgeting.
• Operating Conditions  Industrial-grade operation from -40 °C to 100 °C suitable for demanding environments.
• Platform-Level Features  The Virtex-II Pro family includes platform capabilities documented in the product datasheet such as embedded processor blocks, RocketIO multi-gigabit transceiver support, dedicated 18×18 multipliers, and advanced clock management—enabling system-level integration when leveraged by the design.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Leverage the industrial temperature range and high I/O count for machine control, motor drives, and process automation interfaces.
• Embedded Processing  Use the Virtex-II Pro platform features for designs that incorporate on-chip processor blocks and hardware acceleration.
• High-Density I/O Systems  The 556 I/O pins and large logic capacity enable data aggregation, protocol bridging, and complex interface routing on a single FPGA.
• Prototyping and System Integration  Stable supply range and abundant on-chip memory make the device suitable for board-level prototypes and subsystem integration where flexible logic and memory are required.

Unique Advantages

• Substantial Logic and Memory in One Device: 20,880 logic elements combined with ~1.62 Mbits of embedded RAM reduce the need for external logic and memory components.
• High I/O Density: 556 I/O pins support wide parallel buses and multiple peripheral interfaces, simplifying board-level routing and reducing connector counts.
• Industrial Temperature Support: Rated from -40 °C to 100 °C, enabling deployment in temperature-demanding environments without additional thermal qualifying of the FPGA itself.
• Carefully Defined Power Envelope: A narrow core voltage range (1.425 V–1.575 V) aids power-supply design and system validation.
• Platform-Level Integration Options: Family-level features documented in the datasheet—such as embedded processor blocks and transceiver/clocking resources—offer pathways to tightly integrated system designs when those features are required.

Why Choose XC2VP20-6FF896I?

The XC2VP20-6FF896I positions itself as a robust Virtex-II Pro platform FPGA targeted at designs that need a strong balance of logic density, embedded memory, and a high pin count in an industrial temperature-grade package. Its 896-ball FCBGA package and surface-mount form factor enable compact board layouts while supporting demanding PCB integration.

For engineers and procurement teams building industrial systems, embedded processing platforms, or high-density I/O subsystems, this device delivers predictable electrical characteristics and platform-level capabilities documented in the Virtex-II Pro family datasheet—helping reduce external components and streamline system architecture.

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