XC2VP20-6FFG1152I

The XC2VP20-6FFG1152I is a Virtex®-II Pro field programmable gate array (FPGA) provided by AMD, delivered in a 1152-ball flip-chip BGA (1152-FCBGA, 35×35) package for surface-mount applications. It combines substantial logic capacity, on-chip memory, and a high I/O count for complex digital designs.

Built and graded for industrial use, this device targets embedded systems and industrial applications that require extensive I/O, significant programmable logic resources, and operation across a wide temperature range.

Key Features

• Logic Capacity — Approximately 20,880 logic elements to implement custom digital functions and state machines.
• Embedded Memory — Approximately 1.622 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage.
• High I/O Count — 564 user I/O pins to interface with a broad range of peripherals, buses, and external devices.
• Package and Mounting — 1152-FCBGA (35×35) flip-chip BGA package for high-density board-level integration; surface-mount mounting type.
• Voltage Supply — Core supply requirement between 1.425 V and 1.575 V for stable operation.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet robust environmental requirements.
• Regulatory Status — RoHS compliant for environmental and manufacturing compliance.

Typical Applications

• Industrial Control & Automation — Implements complex control logic and I/O aggregation with industrial temperature tolerance and large logic capacity.
• Embedded System Integration — Integrates custom peripherals and glue-logic where substantial on-chip RAM and programmable logic accelerate development.
• High-density I/O Bridging — Acts as a protocol bridge or I/O concentrator leveraging 564 available I/Os for board-level interfacing.
• Data Acquisition & Signal Processing — Provides local memory and logic resources for buffering, preprocessing, and formatting of sensor or instrument data.

Unique Advantages

• High Logic Density: Approximately 20,880 logic elements let you implement sizable custom logic and state machines on a single device, reducing BOM complexity.
• Substantial On-chip Memory: Approximately 1.622 Mbits of embedded RAM supports local buffering and reduces external memory requirements.
• Extensive I/O Reach: 564 I/O pins enable direct connectivity to numerous peripherals and interfaces without additional multiplexing hardware.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and classified as industrial grade for deployment in demanding environments.
• Compact, High-density Package: 1152-FCBGA (35×35) package provides dense routing and a small PCB footprint for space-constrained designs.
• Compliance-ready: RoHS compliance simplifies environmental qualification and supports modern manufacturing requirements.

Why Choose XC2VP20-6FFG1152I?

The XC2VP20-6FFG1152I delivers a balanced combination of logic capacity, embedded memory, and a high number of I/Os in an industrial-grade FCBGA package, making it well suited to embedded and industrial designs that require on-board programmability and robust environmental performance. Its supply voltage range and surface-mount FCBGA footprint facilitate integration into standard board designs while minimizing external component count.

Choose this FPGA when your design needs scalable programmable logic, meaningful on-chip RAM, and broad I/O connectivity in an industrial-rated package with RoHS compliance—providing long-term value through reduced system complexity and flexible hardware programmability.

Request a quote or submit an RFQ today to check availability and pricing for the XC2VP20-6FFG1152I.