XC2VP20-6FG676I

IC FPGA 404 I/O 676FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 404 1622016 20880 676-BGA

Quantity 543 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BGANumber of I/O404Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2320Number of Logic Elements/Cells20880
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1622016

Overview of XC2VP20-6FG676I – Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 404 1622016 20880 676-BGA

The XC2VP20-6FG676I is a Virtex®-II Pro platform FPGA in a 676-BGA package designed for industrial applications. As a member of the Virtex-II Pro family, it combines a flexible FPGA fabric with family-level features such as embedded processor blocks and high-performance serial transceiver technology for system-level integration.

This device targets designs that require a large I/O count, substantial on-chip memory and logic resources, and operation across industrial temperature ranges. Its value proposition centers on integration of logic, embedded memory, and I/O in a single surface-mount package to simplify complex digital and embedded system designs.

Key Features

  • Logic Resources — 2,320 configurable logic blocks and 20,880 logic elements provide a substantial programmable fabric for control, signal processing, and glue-logic functions.
  • Embedded Memory — Approximately 1.622 Mbits of on-chip RAM for data buffering, FIFOs, and local storage.
  • I/O Capacity — 404 user I/O pins support extensive peripheral and interface connectivity in demanding systems.
  • Embedded Processor & FPGA Platform (Family Feature) — The Virtex-II Pro family supports embedded processor blocks, including PowerPC processor integration, enabling tightly coupled hardware/software designs.
  • High-Speed Serial I/O (Family Feature) — Family-level support for RocketIO multi-gigabit transceivers provides a path for high-bandwidth serial links in telecom and datacom applications.
  • Package & Mounting — 676-ball FBGA (27 × 27) in a surface-mount package streamlines PCB layout for dense system boards.
  • Power Supply — Core voltage range of 1.425 V to 1.575 V to match system power domains and enable stable operation.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Compliance — RoHS compliant, meeting environmental requirements for lead-free assembly.

Typical Applications

  • Telecom & Datacom Systems — High I/O density and family-level RocketIO transceiver support suit packet processing, line cards, and aggregation equipment.
  • Embedded Processing Platforms — Integration of processor blocks with FPGA fabric supports hardware-accelerated embedded systems and real-time control applications.
  • Industrial Control & Automation — Industrial temperature rating and broad I/O make the device suitable for motor control, PLCs, and factory automation controllers.
  • High-Density I/O Systems — 404 user I/Os enable complex sensor interfaces, protocol bridging, and custom I/O subsystems.

Unique Advantages

  • Highly Integrated Platform: Combines programmable logic, embedded memory, and family-level embedded processor/transceiver features to reduce system component count.
  • Substantial On-Chip Resources: More than 20,000 logic elements and approximately 1.622 Mbits of RAM support medium-complexity designs without external memory.
  • Extensive I/O Capability: 404 I/O pins provide flexibility for interfacing multiple peripherals and buses.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation to meet the requirements of industrial deployments.
  • Standard BGA Footprint: 676-FBGA (27 × 27) package simplifies placement on dense PCBs while supporting surface-mount assembly.
  • Environmentally Compliant: RoHS compliance supports lead-free manufacturing processes.

Why Choose XC2VP20-6FG676I?

The XC2VP20-6FG676I positions itself as a robust choice for industrial and system-level designs that need a balanced combination of logic capacity, embedded memory, and high I/O density in a single FPGA package. Its family pedigree brings embedded processing and multi-gigabit transceiver capabilities for designs that require close hardware/software integration and high-bandwidth links.

Engineers and procurement teams seeking a documented, industrial-grade Virtex-II Pro device will find this part offers the on-chip resources and thermal tolerance necessary for complex embedded systems, telecom/datacom modules, and industrial control applications.

Request a quote or submit an inquiry for pricing and availability to evaluate XC2VP20-6FG676I for your next design.

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