XC2VP20-6FG676I
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 404 1622016 20880 676-BGA |
|---|---|
| Quantity | 543 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 404 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2320 | Number of Logic Elements/Cells | 20880 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1622016 |
Overview of XC2VP20-6FG676I – Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 404 1622016 20880 676-BGA
The XC2VP20-6FG676I is a Virtex®-II Pro platform FPGA in a 676-BGA package designed for industrial applications. As a member of the Virtex-II Pro family, it combines a flexible FPGA fabric with family-level features such as embedded processor blocks and high-performance serial transceiver technology for system-level integration.
This device targets designs that require a large I/O count, substantial on-chip memory and logic resources, and operation across industrial temperature ranges. Its value proposition centers on integration of logic, embedded memory, and I/O in a single surface-mount package to simplify complex digital and embedded system designs.
Key Features
- Logic Resources — 2,320 configurable logic blocks and 20,880 logic elements provide a substantial programmable fabric for control, signal processing, and glue-logic functions.
- Embedded Memory — Approximately 1.622 Mbits of on-chip RAM for data buffering, FIFOs, and local storage.
- I/O Capacity — 404 user I/O pins support extensive peripheral and interface connectivity in demanding systems.
- Embedded Processor & FPGA Platform (Family Feature) — The Virtex-II Pro family supports embedded processor blocks, including PowerPC processor integration, enabling tightly coupled hardware/software designs.
- High-Speed Serial I/O (Family Feature) — Family-level support for RocketIO multi-gigabit transceivers provides a path for high-bandwidth serial links in telecom and datacom applications.
- Package & Mounting — 676-ball FBGA (27 × 27) in a surface-mount package streamlines PCB layout for dense system boards.
- Power Supply — Core voltage range of 1.425 V to 1.575 V to match system power domains and enable stable operation.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Compliance — RoHS compliant, meeting environmental requirements for lead-free assembly.
Typical Applications
- Telecom & Datacom Systems — High I/O density and family-level RocketIO transceiver support suit packet processing, line cards, and aggregation equipment.
- Embedded Processing Platforms — Integration of processor blocks with FPGA fabric supports hardware-accelerated embedded systems and real-time control applications.
- Industrial Control & Automation — Industrial temperature rating and broad I/O make the device suitable for motor control, PLCs, and factory automation controllers.
- High-Density I/O Systems — 404 user I/Os enable complex sensor interfaces, protocol bridging, and custom I/O subsystems.
Unique Advantages
- Highly Integrated Platform: Combines programmable logic, embedded memory, and family-level embedded processor/transceiver features to reduce system component count.
- Substantial On-Chip Resources: More than 20,000 logic elements and approximately 1.622 Mbits of RAM support medium-complexity designs without external memory.
- Extensive I/O Capability: 404 I/O pins provide flexibility for interfacing multiple peripherals and buses.
- Industrial Reliability: Rated for −40 °C to 100 °C operation to meet the requirements of industrial deployments.
- Standard BGA Footprint: 676-FBGA (27 × 27) package simplifies placement on dense PCBs while supporting surface-mount assembly.
- Environmentally Compliant: RoHS compliance supports lead-free manufacturing processes.
Why Choose XC2VP20-6FG676I?
The XC2VP20-6FG676I positions itself as a robust choice for industrial and system-level designs that need a balanced combination of logic capacity, embedded memory, and high I/O density in a single FPGA package. Its family pedigree brings embedded processing and multi-gigabit transceiver capabilities for designs that require close hardware/software integration and high-bandwidth links.
Engineers and procurement teams seeking a documented, industrial-grade Virtex-II Pro device will find this part offers the on-chip resources and thermal tolerance necessary for complex embedded systems, telecom/datacom modules, and industrial control applications.
Request a quote or submit an inquiry for pricing and availability to evaluate XC2VP20-6FG676I for your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








