XC2VP20-6FG676C

The XC2VP20-6FG676C is a Virtex®-II Pro field programmable gate array (FPGA) supplied by AMD. It delivers a high-density, configurable logic platform with approximately 20,880 logic elements and approximately 1.62 Mbits of embedded memory, packaged in a 676-ball fine-pitch BGA for surface-mount assembly.

Designed for commercial-grade applications, the device provides extensive I/O and configurable resources for embedded processing, high-speed serial interfaces, and custom logic implementations, while operating from a 1.425 V to 1.575 V core supply and a 0 °C to 85 °C ambient range.

Key Features

• Logic Capacity  Approximately 20,880 logic elements suitable for complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 1.62 Mbits of on-chip RAM (1,622,016 bits) for packet buffering, FIFOs, and data storage.
• I/O Resources  404 dedicated I/O pins to support broad external device interfacing and board-level connectivity.
• Power and Voltage  Core supply voltage range of 1.425 V to 1.575 V to match modern FPGA power domains and board power budgets.
• Package and Mounting  676-FBGA (27×27) package case in a surface-mount format for compact, high-density PCB designs.
• Operating Range & Grade  Commercial-grade device specified for 0 °C to 85 °C operation; RoHS‑compliant.
• Family Capabilities (per datasheet)  The Virtex‑II Pro family includes platform features such as embedded processor cores, multi‑gigabit RocketIO transceivers, dedicated 18×18 multiplier blocks, advanced clock management, and SelectRAM memory hierarchy for integrated system designs.

Typical Applications

• Embedded Processing and Control  FPGA logic combined with family-level embedded processor support enables offloaded control tasks and system integration on a single device.
• High‑Speed Serial Communications  Family transceiver capabilities (RocketIO) make the device suitable for designs requiring multi‑gigabit serial links.
• Custom DSP and Signal Processing  Dedicated 18×18 multiplier resources and substantial logic capacity support FIR filters, data formatting, and algorithm acceleration.
• I/O‑Intensive Systems  With 404 I/Os, the device handles extensive sensor, memory, or peripheral interfacing for complex board-level systems.

Unique Advantages

• High logic density:  Approximately 20,880 logic elements enable large, integrated designs without immediate need for multiple devices.
• Significant on‑chip memory:  Approximately 1.62 Mbits of embedded RAM reduces dependence on external memory for buffering and packet storage.
• Robust I/O count:  404 I/Os provide flexible routing and direct connections to many peripherals and interfaces.
• Compact, manufacturable package:  676-FBGA (27×27) surface-mount package supports dense PCB layouts while maintaining serviceable pin counts.
• Commercial temperature and RoHS compliance:  Designed for standard commercial environments with environmental compliance for regulated assemblies.

Why Choose XC2VP20-6FG676C?

The XC2VP20-6FG676C positions itself as a versatile, high-density FPGA option for commercial applications requiring substantial logic, embedded memory, and broad I/O capability in a single-package solution. Its combination of logic resources, on-chip RAM, and a high pin-count BGA package makes it suitable for embedded processing, communications, and DSP-focused designs.

Engineers selecting this device benefit from a proven Virtex‑II Pro family architecture and a compact footprint that supports integration and scalability across mid-range system designs, while adhering to commercial temperature and RoHS requirements.

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