XC2VP20-6FGG676C

The XC2VP20-6FGG676C is a Virtex®-II Pro field programmable gate array (FPGA) supplied in a 676-ball fine-pitch BGA (27×27) package for surface-mount assembly. It provides a dense programmable-logic fabric with 20,880 logic elements and approximately 1.622 Mbits of embedded memory, making it suitable for commercial embedded systems requiring substantial on-chip logic and memory resources.

With 404 user I/O, on-package power requirements between 1.425 V and 1.575 V, and a commercial operating range of 0 °C to 85 °C, this device targets high-density, I/O-rich applications where integration and configurability are key.

Key Features

• Logic Capacity – 20,880 logic elements to implement complex digital functions and custom logic blocks.
• Embedded Memory – Approximately 1.622 Mbits of on-chip RAM for data buffering, FIFOs, and embedded storage.
• I/O – 404 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting – 676-ball FBGA (27×27) package in a surface-mount form factor for high-density PCB layouts.
• Power – Specified core supply range of 1.425 V to 1.575 V to match system power rails and regulator choices.
• Temperature & Grade – Commercial grade operation from 0 °C to 85 °C, suitable for standard commercial deployments.
• On-chip Resources (Series Capabilities) – Virtex®-II Pro family features include embedded multi‑gigabit RocketIO transceivers, embedded PowerPC processor blocks, SelectRAM™ memory hierarchy, 18‑bit × 18‑bit multiplier blocks, and advanced clock management such as DCMs (as documented for the Virtex‑II Pro family).
• Compliance – RoHS compliant for environmental and manufacturing process compatibility.

Typical Applications

• Networking & Telecom – Leverages the Virtex‑II Pro family’s RocketIO transceiver capabilities and high I/O count for high-throughput interface bridging and protocol implementations.
• Embedded Processing – Suitable for commercial embedded systems that can take advantage of on-chip processor blocks and abundant logic and memory for acceleration and custom control functions.
• High‑Density I/O Systems – 404 available I/O make this device well suited for multi-channel data acquisition, sensor aggregation, and peripheral-rich control applications.

Unique Advantages

• High on‑chip integration: Combines substantial logic (20,880 logic elements) and embedded memory (~1.622 Mbits) to minimize external components and simplify board-level design.
• Generous I/O footprint: 404 user I/O pins enable complex interfacing without extensive multiplexing or external expanders.
• Surface-mount BGA package: 676‑FBGA (27×27) provides a compact footprint for space-constrained commercial designs while supporting high pin count routing.
• Family-level transceiver and processing options: Access to Virtex‑II Pro family features such as RocketIO transceivers and embedded PowerPC blocks allows designers to address high-speed serial links and on‑chip processing where required.
• Regulatory and manufacturing readiness: RoHS compliance supports modern assembly processes and environmental requirements.

Why Choose XC2VP20-6FGG676C?

The XC2VP20-6FGG676C delivers a balance of programmable logic density, embedded memory, and a large I/O count in a compact 676‑FBGA package. It is well suited to commercial designs that require flexible, reconfigurable hardware for protocol handling, data aggregation, and embedded acceleration while keeping board-level component count low.

Designers benefit from the Virtex‑II Pro family’s architectural features—documented multi‑gigabit transceivers, embedded processor block support, dedicated multiplier and memory resources, and advanced clock management—providing a scalable platform for mid-to-high complexity FPGA-based solutions.

If you would like pricing, availability, or a quote for XC2VP20-6FGG676C, submit a request or inquiry and our team will respond with the next steps.