XC2VP20-7FGG676C

The XC2VP20-7FGG676C is a Virtex®-II Pro platform FPGA designed for applications that require a high degree of on-chip logic, embedded memory and dense I/O in a compact BGA package. Built on the Virtex-II Pro architecture, this device targets designs that combine configurable logic, substantial embedded RAM and broad external connectivity under a commercial temperature grade.

With 2,320 CLBs (approximately 20,880 logic elements), roughly 1.62 Mbits of on-chip RAM and 404 user I/O, the XC2VP20-7FGG676C balances logic density and I/O count for mid- to high-complexity FPGA-based systems.

Key Features

• Core Logic Capacity — 2,320 CLBs and 20,880 logic elements provide abundant programmable fabric for control, signal processing and custom logic functions.
• Embedded Memory — Approximately 1.62 Mbits of on-chip RAM for data buffering, FIFOs and local storage without external memory dependency.
• I/O Density — 404 user I/O pins to support broad system interfacing and multiple parallel buses or peripheral connections.
• Package — 676-ball FBGA (27 × 27) surface-mount package for a compact board footprint with high pin-count routing capability.
• Supply Voltage — Core supply range of 1.425 V to 1.575 V to match system power domains and regulator rails.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for typical commercial and industrial-environment applications.
• DSP & Arithmetic Resources — Virtex-II Pro family architecture includes dedicated multiplier blocks suitable for implementing multiply-accumulate and fixed-point DSP functions.
• SRAM-Based Configurability — Platform architecture supports in-system configuration and flexible re-programmability consistent with Virtex-II Pro devices.
• RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing processes.

Typical Applications

• Embedded Processing Platforms — Implement custom control logic, offload functions from host processors and integrate local buffering using on-chip RAM and plentiful CLBs.
• Communications & Networking — Use dense I/O and programmable logic to handle packet processing, protocol bridging and interface adaptation in networking equipment.
• High-Density I/O Systems — Drive parallel sensors, data acquisition fronts or multi-channel interfaces where many I/O pins and local processing are required.

Unique Advantages

• Balanced Logic and Memory — Combination of 2,320 CLBs and ~1.62 Mbits on-chip RAM reduces dependence on external memory and simplifies board-level BOM.
• High I/O Count in a Compact Package — 404 user I/O in a 676-FBGA (27 × 27) footprint supports complex interfacing while preserving board space.
• Commercial Temperature and RoHS Compliance — Suited for mainstream commercial deployments with environmental and manufacturability considerations addressed.
• Platform-Level Capabilities — Built on the Virtex-II Pro architecture, offering established FPGA features such as dedicated multipliers and in-system configurability for iterative development.
• Tight Core Voltage Window — Defined 1.425 V to 1.575 V supply range simplifies power-supply design and margining in system integration.

Why Choose XC2VP20-7FGG676C?

The XC2VP20-7FGG676C positions itself as a versatile mid-range Virtex-II Pro FPGA offering a strong mix of programmable logic, embedded RAM and high I/O density in a compact FBGA package. It is well suited to electronics designers who need reconfigurable hardware for embedded processing, data interfacing and multi-channel systems within a commercial temperature envelope.

Choosing this device provides access to the Virtex-II Pro platform architecture and features that simplify implementation of DSP, buffering and I/O-intensive functions while maintaining RoHS compliance and predictable supply and thermal parameters.

Request a quote or submit an inquiry to purchase the XC2VP20-7FGG676C and discuss availability, lead times and pricing for your next FPGA-based design.