XC2VP20-7FG676C

The XC2VP20-7FG676C is a Virtex®-II Pro platform Field Programmable Gate Array (FPGA) from AMD. It provides a blend of programmable logic, embedded memory, and I/O capacity packaged in a 676-ball fine-pitch BGA for high-density system designs.

Designed for commercial applications, the device targets use cases requiring flexible FPGA fabric, substantial on-chip RAM, and extensive I/O. Platform-level capabilities described in the Virtex-II Pro family documentation include embedded multi-gigabit transceivers and processor blocks for tightly integrated system architectures.

Key Features

• Logic Resources  Approximately 20,880 logic elements providing a flexible fabric for custom digital logic implementation.
• Embedded Memory  Approximately 1.62 Mbits of total on-chip RAM to support buffers, FIFOs, and local data storage.
• I/O Capacity  404 user I/O pins to support wide parallel interfaces, memory buses, and peripheral connectivity.
• Package  676-ball Fine-Pitch BGA (676-FBGA, 27 × 27) for compact, high-density board integration.
• Power Supply  Core supply specified at 1.425 V to 1.575 V to match typical Virtex-II Pro power domains.
• Operating Range  Commercial grade operation from 0 °C to 85 °C.
• Platform-Level Capabilities  Virtex-II Pro platform documentation describes embedded multi-gigabit RocketIO transceivers and up to two PowerPC RISC processor blocks as part of the family architecture.
• Regulatory  RoHS compliant.

Typical Applications

• Telecom & Datacom  Platform transceiver support and high I/O count enable implementation of serial interfaces, protocol bridging, and line-side logic in communications equipment.
• Embedded Processing  On-chip RAM and the Virtex-II Pro platform’s processor-block options support offload and control tasks alongside custom logic.
• Signal Processing & Acceleration  Dedicated multipliers and sizable embedded memory make the device suitable for DSP kernels, acceleration blocks, and real-time data paths.
• Prototyping & System Integration  High logic density and comprehensive I/O allow integration of multiple system functions during development and prototyping phases.

Unique Advantages

• Highly configurable logic: The device’s ~20,880 logic elements let designers implement complex custom-state machines, datapaths, and control logic without external ASICs.
• Significant on-chip memory: Approximately 1.62 Mbits of embedded RAM reduces external memory dependence for buffering and local storage, simplifying board-level design.
• High I/O capacity in a compact package: 404 I/Os in a 676-FBGA (27 × 27) package enable dense interfacing while maintaining a small PCB footprint.
• Platform integration options: Family-level support for embedded processor blocks and multi-gigabit transceivers allows tighter system-level integration when used within Virtex-II Pro designs.
• Commercial, RoHS-compliant part: Commercial operating range (0 °C to 85 °C) and RoHS compliance support mainstream electronics manufacturing and deployment.

Why Choose XC2VP20-7FG676C?

The XC2VP20-7FG676C positions itself as a commercially graded Virtex-II Pro platform FPGA that balances logic density, embedded memory, and broad I/O capability in a fine-pitch BGA package. It is well suited to system designs that need flexible programmable logic alongside platform-level features described for the Virtex-II Pro family.

Designers and procurement teams looking for a RoHS-compliant FPGA with substantial on-chip resources, a compact BGA footprint, and support for platform integration options will find the XC2VP20-7FG676C an effective choice for commercial embedded and communications applications.

Request a quote or submit a purchase inquiry for part number XC2VP20-7FG676C to receive pricing and availability details for your project requirements.