XC2VP30-5FF1152I

The XC2VP30-5FF1152I is a Virtex®-II Pro field-programmable gate array (FPGA) in a 1152-ball FCBGA package, offered in an industrial temperature grade. It delivers high-density programmable logic alongside a large I/O count and embedded memory for complex embedded processing and high-density I/O applications.

This device is suited for designs that require substantial logic resources, abundant user I/O, and on-chip memory in a surface-mount FCBGA package. Its architecture supports processor integration and high-speed serial/transceiver functionality as described for the Virtex-II Pro family.

Key Features

• High logic density — 30,816 logic elements for implementing complex digital logic and control functions.
• Embedded memory — Approximately 2.51 Mbits of on-chip RAM (total RAM bits: 2,506,752) to support buffers, FIFOs and on-chip data storage.
• Extensive I/O — 644 user I/O pins to interface with high-pin-count systems and multiple peripherals.
• Package and mounting — 1152-ball FCBGA (35×35) package, surface-mount mounting type; package case listed as 1152-BBGA, FCBGA.
• Industrial temperature grade — Operating temperature range from −40 °C to 100 °C for industrial environments.
• Power supply — Core voltage supply range: 1.425 V to 1.575 V.
• Virtex-II Pro family capabilities — Series-level features include support for embedded multi-gigabit transceivers (RocketIO/RocketIO X) and up to two IBM PowerPC processor blocks as described in the Virtex-II Pro documentation.
• On-chip DSP and clock management — The Virtex-II Pro family provides dedicated multiplier blocks and digital clock management features (as detailed in the family datasheet).
• RoHS compliant — Meets RoHS environmental compliance requirements.

Typical Applications

• High-performance embedded systems — Combine on-chip logic and large embedded memory for control, signal processing, and custom compute tasks.
• Network and communications equipment — Leverage the Virtex-II Pro family’s multi-gigabit transceiver capability and high I/O count for data-path and interface implementations.
• Industrial automation and control — Industrial temperature rating and robust I/O density make the device suitable for complex control and monitoring systems.
• Video and imaging pipelines — Large logic fabric and on-chip RAM support real-time buffering and processing pipelines.

Unique Advantages

• High integration density: 30,816 logic elements and approximately 2.51 Mbits of embedded memory reduce external component needs and simplify board-level design.
• Large I/O capability: 644 I/O pins enable broad connectivity to peripherals, high-speed interfaces, and parallel buses.
• Industrial-ready thermal range: Rated from −40 °C to 100 °C to meet demanding environmental requirements.
• Compact, assembly-friendly package: 1152-ball FCBGA (35×35) offers a high pin count in a compact footprint for dense system designs.
• Series-level embedded processing and transceivers: Support in the Virtex-II Pro family for embedded PowerPC processor blocks and RocketIO transceivers provides options for integrated processor-based designs and high-speed serial links.
• Standards-minded sourcing: RoHS compliance simplifies environmental regulatory alignment.

Why Choose XC2VP30-5FF1152I?

The XC2VP30-5FF1152I positions itself as a high-density Virtex-II Pro FPGA option for applications that require a combination of significant logic resources, substantial on-chip memory, and a large number of I/O signals in an industrial-temperature, surface-mount FCBGA package. It aligns with system designs that benefit from integrated processor and transceiver capabilities present in the Virtex-II Pro family.

Engineers and procurement teams selecting this device gain a scalable FPGA platform that supports complex embedded processing tasks and dense I/O requirements while maintaining industrial operating limits and RoHS compliance.

Request a quote for XC2VP30-5FF1152I to check availability and pricing or to submit your procurement inquiry.