XC2VP30-5FF896I

The XC2VP30-5FF896I is an industrial-grade Virtex®-II Pro FPGA offered in a 896-ball flip-chip BGA package (31×31) for surface-mount applications. Built on the Virtex-II Pro platform, the device provides a balance of programmable logic, embedded memory and high I/O density for demanding embedded, telecom and industrial designs.

Its architecture—documented in the Virtex-II Pro family specification—supports high-integration system designs where on-chip logic, dedicated memory and advanced I/O counts are required. The XC2VP30-5FF896I targets applications that benefit from extensive logic resources, substantial embedded RAM and a large number of user I/Os within a compact FCBGA footprint.

Key Features

• Logic Resources — Approximately 30,816 logic elements organized across 3,424 CLBs to implement complex digital logic and state machines.
• Embedded Memory — Approximately 2.5 Mbits of on-chip RAM (total RAM bits: 2,506,752) for lookup tables, FIFOs and buffering.
• I/O Capacity — 556 user I/Os for broad interface support and dense board-level connectivity.
• Virtex-II Pro Family Capabilities — Family-level features include embedded Multi-Gigabit RocketIO transceivers, up to two embedded IBM PowerPC processor blocks, dedicated 18×18 multiplier blocks and digital clock management (as described in the Virtex-II Pro documentation).
• Package and Mounting — 896-FCBGA (31×31) flip-chip BGA, surface-mount package suitable for compact, high-density PCB designs.
• Power and Thermal — Core supply range 1.425 V to 1.575 V; industrial operating temperature range from −40 °C to 100 °C.
• Compliance — RoHS compliant.
• Documentation and IP Support — Backed by Virtex-II Pro family documentation covering architecture, IP core and reference support, transceiver and processor block functional descriptions.

Typical Applications

• Telecommunications & Datacom — Use where high I/O density and family-level RocketIO transceiver features are applied for high-speed serial links and network interfacing.
• Embedded Processing & Control — Platforms that leverage on-chip resources and available PowerPC processor block options within the Virtex-II Pro family for system control and protocol handling.
• Industrial Automation & Instrumentation — Industrial-grade temperature range and high I/O count for sensor aggregation, motor control interfaces and deterministic control logic.
• High-Density Prototyping & System Integration — Compact FCBGA packaging and sizable logic/memory complement make the device suitable for proof-of-concept systems and tightly integrated board-level designs.

Unique Advantages

• High integration density: Large logic element count and substantial embedded RAM allow consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Extensive I/O connectivity: 556 user I/Os support complex peripheral and bus interfacing without external I/O expanders.
• Industrial operating range: Rated from −40 °C to 100 °C for reliability in temperature-challenging environments.
• Compact flip‑chip BGA: 896-FCBGA (31×31) package enables space-efficient PCB layouts for dense system designs.
• Platform-level resources: Access to Virtex-II Pro family features—such as multi-gigabit transceivers, embedded processor blocks and dedicated multiplier blocks—facilitates system designs that require mixed logic, DSP and embedded processing.
• Standards-conscious supply and compliance: Core voltage range of 1.425–1.575 V and RoHS compliance simplify power planning and environmental compliance tracking.

Why Choose XC2VP30-5FF896I?

The XC2VP30-5FF896I combines a substantial logic fabric, meaningful on-chip memory and a high I/O count in a compact 896-FCBGA package tailored for industrial use. It is well-suited to engineers designing integration-heavy systems that require dense programmable logic, deterministic I/O and industrial temperature capability.

Selected for projects that leverage the Virtex-II Pro platform, this device benefits from comprehensive family-level documentation and IP reference material to accelerate development of telecom, embedded processing and industrial control systems while keeping board-level complexity manageable.

Request a quote or submit a parts inquiry to obtain pricing and availability for the XC2VP30-5FF896I. Our team can provide volume pricing, lead-time information and assistance with order placement.