XC2VP30-5FFG896C

The XC2VP30-5FFG896C is a Virtex®-II Pro field programmable gate array supplied in an 896-ball FCBGA package (31 × 31). It provides a high-density, configurable logic fabric with extensive on-chip memory and a large I/O count for system-level integration in commercial-temperature applications.

Built on the Virtex-II Pro platform, this device targets designs that require significant logic resources, embedded memory, and broad I/O connectivity while operating from a 1.425 V to 1.575 V core supply and within a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity — 30,816 logic elements across approximately 3,424 configurable logic blocks, enabling complex digital functions and custom datapaths.
• Embedded Memory — Approximately 2.5 Mbits of on-chip RAM for buffering, FIFOs, and local storage to support high-throughput logic.
• Dedicated DSP Resources — Includes 18-bit × 18-bit multiplier blocks for fixed-point multiply-accumulate and DSP tasks as described in the Virtex®-II Pro family documentation.
• I/O Density — 556 user I/Os to support wide parallel interfaces, bus bridges, and multi-channel I/O requirements.
• High-Performance Platform Features — Family-level architecture includes options such as RocketIO multi-gigabit transceivers, on-chip processor blocks, digital clock management, and digitally controlled impedance (DCI), as documented for the Virtex®-II Pro family.
• Package & Mounting — 896-FCBGA (31 × 31) package in a surface-mount format for compact board-level integration.
• Power & Thermal — Core supply range of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Implement complex control logic, protocol handling, and custom state machines using the device’s large logic element count and on-chip memory.
• Communications and I/O aggregation — Use the high I/O count and family-level multi-gigabit transceiver features for board-level data routing, aggregation, and interface bridging.
• Embedded system controllers — Combine logic, embedded memory, and on-chip processing features from the Virtex®-II Pro family to build system controllers and hardware accelerators.
• Signal processing — Leverage dedicated multiplier blocks and local RAM to implement DSP kernels, filters, and custom fixed-point arithmetic pipelines.

Unique Advantages

• High integration density: 30,816 logic elements and approximately 2.5 Mbits of RAM reduce external component count and simplify system architecture.
• Extensive I/O capability: 556 user I/Os accommodate broad peripheral connectivity and parallel interfaces without extensive glue logic.
• Platform-level feature set: Virtex®-II Pro family features such as RocketIO transceivers, processor block support, and advanced clock management enable system-level designs that integrate processing and high-speed serial I/O.
• Surface-mount FCBGA package: 896-FCBGA (31 × 31) offers compact board footprint and reliable ball-grid mounting for production deployments.
• Commercial-grade operating range: Specified for 0 °C to 85 °C, suitable for a wide range of commercial and industrial-adjacent applications.
• Regulatory readiness: RoHS compliance supports environmental and supply-chain requirements.

Why Choose XC2VP30-5FFG896C?

The XC2VP30-5FFG896C positions itself as a high-density member of the Virtex®-II Pro family, combining tens of thousands of logic elements, multiple megabits of embedded RAM, and a large I/O count in a compact 896-FCBGA package. Its platform-level capabilities—documented support for embedded processor blocks, advanced clock management, and multi-gigabit transceiver technology—make it suitable for designs that need an integrated, configurable hardware foundation.

This device is well suited for teams developing complex digital systems, I/O-dense controllers, and hardware-accelerated signal processing functions who require verifiable on-chip resources and a commercial temperature rating. The combination of logic, memory, and package density provides a scalable base for prototype and production boards within the Virtex®-II Pro platform ecosystem.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the XC2VP30-5FFG896C.