XC2VP30-5FGG676C

The XC2VP30-5FGG676C is a Virtex®-II Pro field-programmable gate array (FPGA) in a 676-ball fine-pitch BGA package. It delivers a balance of programmable logic, embedded memory, and high I/O density for complex digital designs.

Based on the Virtex‑II Pro platform, the device targets applications that require significant on-chip logic capacity, substantial embedded RAM, and a large number of I/O signals. Its platform-level capabilities include multi-gigabit transceiver and embedded processor block options across the family.

Key Features

• Logic Capacity — 30,816 logic elements to implement complex custom logic and control functions.
• Embedded Memory — Approximately 2.5 Mbits of total on-chip RAM (2,506,752 bits) for buffering, FIFOs, and local data storage.
• I/O Density — 416 user I/O pins to support wide parallel interfaces and mixed-signal board-level connectivity.
• Package & Mounting — 676-ball fine-pitch BGA (676-FBGA, 27 × 27) in a surface-mount form factor for high-density PCB implementations.
• Power Supply — Core voltage range of 1.425 V to 1.575 V to match system power domains.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C for standard embedded and commercial electronics applications.
• RoHS Compliant — Conforms to RoHS requirements for lead-free assembly and regulatory alignment.
• Virtex‑II Pro Platform Capabilities — Family-level features include support for embedded multi-gigabit RocketIO transceivers, embedded processor blocks (PowerPC™ cores on some devices), dedicated 18×18 multipliers, and comprehensive clock management and SelectRAM memory hierarchy.

Typical Applications

• Network & Telecom Equipment — Implements packet processing, protocol bridging, and high-density I/O aggregation where large logic capacity and embedded RAM are required.
• Embedded Processing Systems — Integrates custom logic with on‑chip memory for control, signal preprocessing, and local buffering in embedded platforms.
• High‑I/O Interface Boards — Drives parallel and mixed-signal interfaces using the device’s 416 I/O pins and high-density 676‑BGA package.
• Prototyping & FPGA-Based Acceleration — Suitable for hardware prototyping and acceleration tasks that benefit from substantial programmable logic and on-chip RAM.

Unique Advantages

• Substantial On-Chip Resources: 30,816 logic elements and approximately 2.5 Mbits of embedded RAM provide the resources needed for complex logic, buffering, and state machines.
• High I/O Count: 416 I/O pins enable wide data buses and flexible board-level interfacing without additional multiplexing logic.
• Compact, High-Density Package: 676-FBGA (27 × 27) offers a dense footprint for space-constrained PCBs while supporting surface-mount assembly.
• Platform-Level Functionality: The Virtex‑II Pro family includes options for multi-gigabit transceivers and embedded processor blocks, allowing scalable platform solutions across device variants.
• Regulatory Alignment: RoHS compliance supports lead‑free assembly processes and environmental requirements.

Why Choose XC2VP30-5FGG676C?

The XC2VP30-5FGG676C positions itself as a capable Virtex‑II Pro platform FPGA offering a significant combination of logic resources, embedded memory, and high I/O density in a compact 676‑BGA package. It is well suited to engineering teams designing commercial embedded systems, interface-rich boards, and FPGA‑based prototypes that require a reliable set of on‑chip resources and platform scalability.

With defined supply voltage and operating temperature ranges alongside RoHS compliance, this device supports typical commercial electronics environments and assembly workflows while providing a clear upgrade path within the Virtex‑II Pro family for designs that may scale in transceiver or embedded processor requirements.

Request a quote or submit an inquiry for pricing and availability of the XC2VP30-5FGG676C to begin integrating this Virtex‑II Pro FPGA into your next design.