XC2VP30-6FF1152C

The XC2VP30-6FF1152C is a Virtex®-II Pro family Field Programmable Gate Array (FPGA) in a 1152-FCBGA (35×35) package from AMD. It delivers a platform-level FPGA architecture with programmable logic, substantial embedded memory, and high I/O density for demanding embedded processing and high-performance interface applications.

Designed for commercial-grade systems, this surface-mount FPGA combines roughly 30,816 logic cells and approximately 2.5 Mbits of embedded RAM with up to 644 I/O pins, enabling complex logic integration and dense system-level interfacing at a device supply voltage between 1.425 V and 1.575 V.

Key Features

• Configurable Logic Resources — Approximately 30,816 logic cells and 3,424 configurable logic blocks (CLBs) to implement complex digital logic and custom processing pipelines.
• Embedded Memory — Approximately 2.5 Mbits of on-chip RAM to support frame buffers, lookup tables, FIFOs and other data-intensive functions without external memory.
• High I/O Count — Up to 644 user I/O pins for dense peripheral interfacing, multi-channel connectivity, and board-level routing flexibility.
• Package and Mounting — 1152-ball FCBGA package (35×35) in a surface-mount form factor for compact, board-level integration.
• Power and Temperature — Nominal supply operation between 1.425 V and 1.575 V with commercial operating temperature range of 0 °C to 85 °C.
• Platform Capabilities (Virtex-II Pro) — Family-level features include support for RocketIO™ multi-gigabit transceivers and up to two embedded PowerPC™ processor blocks, providing options for high-speed serial links and embedded processing (refer to family datasheet for specific device capabilities).
• Regulatory — RoHS compliant, supporting lead-free manufacturing processes and environmental compliance requirements.

Typical Applications

• High-Speed Communications: Use the Virtex-II Pro platform capabilities for multi-gigabit serial interfaces and telecom/datacom building blocks where high I/O density and on-chip resources reduce external component counts.
• Embedded Processing Systems: Implement custom processing engines or integrate embedded processor cores for control, signal processing, or protocol offload tasks within the FPGA fabric.
• Board-Level Prototyping and System Integration: Combine large logic capacity and abundant I/O to validate complex system designs, perform hardware emulation, or consolidate multiple discrete components into a single FPGA-based solution.
• Data Buffering and Memory-Intensive Logic: Leverage approximately 2.5 Mbits of embedded RAM for frame buffering, packet queues, and temporary data storage without immediate need for external memory.

Unique Advantages

• High Logic Density: Approximately 30,816 logic cells allow implementation of substantial custom logic and parallel datapaths within a single device.
• Integrated Memory Resources: Around 2.5 Mbits of embedded RAM reduce BOM and simplify board layouts by minimizing dependence on external memory for many use cases.
• Extensive I/O: Up to 644 I/O pins provide flexibility for multi-interface designs, sensor arrays, and high-pin-count connectivity requirements.
• Surface-Mount, High-Density Packaging: The 1152-FCBGA (35×35) package supports compact system layouts while delivering the routing and power planes required for complex designs.
• Commercial Temperature and RoHS Compliance: Designed for 0 °C to 85 °C operation and RoHS-compliant manufacturing to align with mainstream electronics production standards.

Why Choose XC2VP30-6FF1152C?

The XC2VP30-6FF1152C positions itself as a versatile platform FPGA for teams that need substantial on-chip logic, meaningful embedded memory, and a high number of I/Os in a compact surface-mount package. Its Virtex-II Pro family heritage brings platform-level capabilities—such as support for multi-gigabit transceivers and embedded processor blocks—making it suitable for applications that combine high-speed interfaces with on-device processing.

This device is well suited for engineering and procurement groups building commercial-grade communication equipment, embedded controllers, or prototyping advanced digital systems where integration, I/O density, and on-chip memory translate directly into reduced system complexity and board-level cost.

Request a quote or submit a purchase inquiry to receive pricing, lead-time information, and assistance integrating the XC2VP30-6FF1152C into your next design.