XC2VP30-6FF896I

The XC2VP30-6FF896I is a Virtex®-II Pro series field programmable gate array (FPGA) supplied in an 896-ball flip-chip BGA (896-FCBGA, 31 × 31) surface-mount package. It delivers a substantial integration of logic resources, embedded memory, and high I/O density for industrial applications.

Designed for systems requiring a balance of logic capacity, on-chip RAM and large I/O counts, the device supports a 1.425 V to 1.575 V core supply and operates across an industrial temperature range of −40 °C to 100 °C. The device is RoHS compliant.

Key Features

• Logic Capacity — 30,816 logic elements (cells) to implement complex digital functions and custom logic networks.
• Configurable Logic Blocks (CLBs) — 3,424 CLBs for flexible logic partitioning and design scalability.
• Embedded Memory — Approximately 2.5 Mbits of on-chip RAM for buffering, FIFOs and tightly coupled data storage.
• High I/O Count — 556 user I/O pins to support dense board-level interconnect and multiple parallel interfaces.
• Package and Mounting — 896-BBGA / 896-FCBGA (31 × 31) surface-mount package for high pin-count, compact system integration.
• Power and Temperature — Core supply range of 1.425 V to 1.575 V and rated for industrial operation from −40 °C to 100 °C.
• Standards Compliance — RoHS compliant, supporting modern manufacturing and environmental requirements.
• Family-Level Platform Features — As a Virtex‑II Pro family device, the platform includes capabilities such as embedded processor block support and high-speed transceiver options (family-level features described in the Virtex‑II Pro documentation).

Typical Applications

• Industrial Control — Use for machine control, motion systems, and programmable automation where robust I/O and industrial temperature operation are required.
• Communications Infrastructure — Suitable for data routing, interface bridging and protocol handling leveraging high I/O counts and on-chip RAM for packet buffering.
• Test & Measurement — Implement signal processing, timing engines and custom test logic using abundant logic elements and embedded memory.
• Embedded Processing Platforms — Deploy in designs that leverage the Virtex‑II Pro family’s processor-block and transceiver capabilities to build processor-assisted or serial-link systems.

Unique Advantages

• High Integration — Combines 30,816 logic elements with approximately 2.5 Mbits of embedded RAM to reduce external component counts and simplify board design.
• Extensive I/O — 556 I/O pins enable dense, multi-interface systems without sacrificing routing flexibility.
• Industrial Reliability — Rated for −40 °C to 100 °C operation, making it suitable for demanding industrial environments.
• Compact High-Pin-Count Package — 896-FCBGA (31 × 31) package supports large pin counts in a compact footprint for space-constrained systems.
• Mature Platform — Part of the Virtex‑II Pro family with documented platform features and technical resources to support system-level integration.
• Regulatory Compatibility — RoHS compliance aligns with modern manufacturing and environmental practices.

Why Choose XC2VP30-6FF896I?

The XC2VP30-6FF896I positions itself as a versatile FPGA option for industrial-grade systems that require significant logic resources, substantial on-chip memory, and a very large number of I/Os in a compact BGA package. Its combination of 30,816 logic elements, approximately 2.5 Mbits of embedded RAM and 556 I/Os supports complex custom processing, buffering and interface tasks without excessive external components.

Engineers targeting industrial automation, communications equipment, test systems or embedded processing platforms will find the device’s electrical supply range, package density and operating temperature suitable for robust, production-grade designs while leveraging the documented capabilities of the Virtex‑II Pro family.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for XC2VP30-6FF896I today.