XC2VP30-6FFG896I

The XC2VP30-6FFG896I is an industrial-grade Virtex®-II Pro platform FPGA provided in a 896-FCBGA package. It combines a high logic capacity with substantial embedded memory and a large I/O complement for demanding embedded and industrial applications.

Designed for systems that require dense logic, generous on-chip RAM and broad I/O, this device targets industrial control, communications infrastructure and high-density I/O subsystems where robust thermal and voltage operating ranges are required.

Key Features

• Logic Capacity 3,424 CLBs and 30,816 logic elements provide a programmable fabric for complex logic integration and custom datapaths.
• Embedded Memory Approximately 2.5 Mbits of on-chip RAM for buffering, FIFOs and state storage directly within the FPGA fabric.
• I/O Density 556 I/O pins support high-density interfaces and multiple parallel data channels.
• Package & Mounting 896-FCBGA package (31x31) in a surface-mount form factor for compact board-level integration.
• Voltage Supply Core supply range of 1.425 V to 1.575 V to match system power rails and design requirements.
• Operating Temperature Industrial operating range from −40 °C to 100 °C for extended-environment reliability.
• RoHS Compliant Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Industrial Control Used for real-time control logic, signal conditioning and machine interfacing where wide temperature range and high I/O count are required.
• Embedded Processing Ideal for integrating custom datapaths, buffering and control logic using the device’s large CLB and on-chip RAM resources.
• Communications Infrastructure Suitable for high-density I/O and protocol bridging in networking and telecom equipment.
• High-Density I/O Systems Fits applications that need many parallel interfaces or multiple independent I/O channels on a single FPGA.

Unique Advantages

• High logic integration: 30,816 logic elements and 3,424 CLBs allow consolidation of multiple functions into a single FPGA, reducing board-level BOM and interconnect complexity.
• Substantial on-chip memory: Approximately 2.5 Mbits of embedded RAM supports large buffers and local data storage without external memory.
• Extensive I/O: 556 I/O pins provide the flexibility to interface with numerous peripherals or parallel buses directly.
• Industrial thermal range: Rated for −40 °C to 100 °C to meet the demands of harsh environment deployments.
• Compact, surface-mount package: 896-FCBGA (31x31) enables a space-efficient implementation for high-density boards.
• Regulatory readiness: RoHS compliance simplifies integration into modern, lead-free manufacturing processes.

Why Choose XC2VP30-6FFG896I?

The XC2VP30-6FFG896I positions itself as a robust Virtex®-II Pro FPGA option for engineers needing a balance of logic density, embedded memory and a high I/O count in an industrial-rated package. Its configurable fabric and on-chip resources make it well suited to system consolidation, custom protocol handling and applications that benefit from a single, high-capacity FPGA.

For design teams targeting industrial and embedded markets, this device offers a clear path to reducing component count while providing the thermal and electrical operating ranges required for reliable system operation.

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