XC2VP30-6FG676I

The XC2VP30-6FG676I is a Virtex®-II Pro platform field programmable gate array supplied in a 676-ball fine-pitch BGA (27×27) package. It delivers a blend of programmable logic, embedded memory, and I/O resources suitable for industrial-grade embedded and communications applications.

Designed for systems requiring high logic capacity and flexible I/O, this device offers a defined operating range and power envelope for predictable integration into industrial environments.

Key Features

• Logic Resources — 30,816 logic elements and 3,424 configurable logic blocks (CLBs) to implement complex digital functions and control logic.
• Embedded Memory — Approximately 2.5 Mbits of on-chip RAM (2,506,752 bits) for buffering, lookup tables, and state storage.
• I/O Density — 416 I/O pins available for broad interfacing options with external devices and systems.
• Power Supply — Core supply range specified from 1.425 V to 1.575 V for stable power management and board-level design.
• Package & Mounting — 676-FBGA (27×27) package, surface-mount construction for standard PCB assembly processes.
• Operating Temperature — Industrial-grade operation from −40 °C to 100 °C to meet temperature requirements for industrial applications.
• Dedicated DSP Primitives — Family-level support includes 18-bit × 18-bit multiplier blocks for efficient arithmetic and signal-processing tasks.
• Platform Capabilities — Based on the Virtex-II Pro platform, the family includes support for embedded processor blocks and RocketIO multi-gigabit transceiver technology as outlined in the Virtex-II Pro product specification.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free manufacturing and compliance.

Typical Applications

• Telecommunications & Networking — High I/O density and platform transceiver capabilities make the device suitable for protocol bridging, packet processing, and line interface functions.
• Industrial Automation — Industrial temperature rating and extensive logic and memory resources support motor control, PLC augmentation, and factory-automation controllers.
• Embedded Processing & Control — Large logic capacity and on-chip memory enable custom compute engines, real-time control, and hardware acceleration.
• Data Acquisition & Instrumentation — Abundant I/O and configurable logic are useful for sensor interfacing, data aggregation, and preprocessing tasks.

Unique Advantages

• High Logic Density: 30,816 logic elements provide headroom for complex finite-state machines, custom datapaths, and glue-logic consolidation.
• Substantial On-Chip Memory: Approximately 2.5 Mbits of embedded RAM reduce reliance on external memory for buffering and LUT-based functions.
• Robust Industrial Range: Specified operation from −40 °C to 100 °C supports deployment in demanding industrial environments.
• Predictable Power Envelope: Narrow core voltage window (1.425 V to 1.575 V) simplifies power-supply design and margining.
• Compact, High-Performance Package: 676-FBGA (27×27) offers dense integration for space-constrained assemblies while maintaining extensive I/O.
• Standards-Aligned Platform Features: The Virtex-II Pro platform provides architectural elements such as dedicated multipliers and platform-level support for embedded processor and transceiver technology.

Why Choose XC2VP30-6FG676I?

The XC2VP30-6FG676I combines substantial programmable logic, meaningful on-chip memory, and high I/O count in a compact 676-ball BGA package tailored for industrial applications. Its defined supply and temperature specifications make it suitable for designs that require predictable electrical and thermal behavior.

This device is well suited to engineers and system designers building communications, industrial control, or embedded processing solutions that benefit from scalable logic resources and platform-level architectural features inherent to the Virtex-II Pro family.

Request a quote or submit a quote today to receive pricing and lead-time information for the XC2VP30-6FG676I. Our team can provide availability and support for procurement and integration planning.