XC2VP30-7FF896C

The XC2VP30-7FF896C is a Virtex®-II Pro field programmable gate array (FPGA) IC from AMD, packaged in an 896‑ball flip-chip BGA (896‑FCBGA, 31×31) designed for surface-mount assembly. It delivers a balanced combination of logic capacity, on-chip memory, and high I/O density for commercial embedded and communications designs.

Built on the Virtex‑II Pro platform, this device targets applications that require significant programmable logic, substantial embedded RAM, and large numbers of I/O while operating within standard commercial temperature and supply limits.

Key Features

• Logic Capacity  Approximately 30,816 logic elements provide the programmable fabric for complex custom logic and control functions.
• Configurable Logic Blocks  Device architecture supports a large number of programmable logic resources suitable for medium-to-high complexity designs.
• Embedded Memory  Approximately 2.5 Mbits of on-chip RAM (2,506,752 bits) for FIFOs, buffers, and data storage without external memory.
• High I/O Count  556 user I/O pins support broad connectivity for interfaces, peripherals, and board-level signals.
• Package & Mounting  896‑ball FCBGA (31×31) package, surface‑mount mounting type, suitable for dense PCB layouts.
• Power  Core voltage supply range 1.425 V to 1.575 V to match standard core power rail designs.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance  RoHS‑compliant for lead‑free production environments.

Typical Applications

• Communications & Networking  High I/O density and Virtex‑II Pro family capabilities suit board‑level implementations that require significant signal interfacing and programmable protocol logic.
• Embedded Processing  Logic capacity and on‑chip memory enable custom control, offload, and glue logic for embedded systems.
• Signal Processing & DSP  Ample logic elements and embedded RAM support mid‑range signal processing tasks and buffering for streaming data flows.

Unique Advantages

• Substantial Logic Density: Approximately 30,816 logic elements allow implementation of sizeable custom logic and control subsystems on a single device.
• On‑Chip Memory: About 2.5 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs, simplifying BOM and board routing.
• Extensive I/O: 556 I/O pins provide flexibility to interface with a wide range of peripherals, buses, and mezzanine modules.
• Compact, High‑Density Package: 896‑ball FCBGA (31×31) delivers a dense footprint for space‑constrained PCBs while supporting high pin count routing.
• Commercial Temperature & Voltage Compatibility: Rated for 0 °C to 85 °C and a 1.425 V–1.575 V core supply, aligning with common commercial system designs.
• RoHS Compliance: Meets lead‑free manufacturing requirements for modern electronics production.

Why Choose XC2VP30-7FF896C?

The XC2VP30-7FF896C combines significant programmable logic capacity, multiple megabits of on‑chip RAM, and a large I/O complement in a compact FCBGA package—making it well suited for commercial embedded, communications, and signal‑processing designs that require integrated, high‑density programmable logic. Its supply voltage window, commercial temperature rating, and RoHS compliance make it a practical choice for standard production environments.

This device is aimed at designers who need a balance of logic resources, memory, and I/O without moving to larger platform classes—offering a scalable option within the Virtex‑II Pro family for mid‑to‑high complexity implementations.

Request a quote or submit an inquiry to check availability and pricing for XC2VP30-7FF896C and evaluate how it fits your next FPGA‑based design.