XC2VP4-5FF672C

IC FPGA 348 I/O 672FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 348 516096 6768 672-BBGA, FCBGA

Quantity 820 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGA, FCBGANumber of I/O348Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs752Number of Logic Elements/Cells6768
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of XC2VP4-5FF672C – Virtex®-II Pro Field Programmable Gate Array (672-FCBGA)

The XC2VP4-5FF672C is a Virtex®-II Pro platform FPGA in a 672‑ball FCBGA package intended for commercial-grade embedded applications. This device provides a balance of programmable logic, on-chip memory and high I/O density for designs that require moderate logic capacity and substantial I/O connectivity.

As a member of the Virtex‑II Pro family, the device is described within a platform that includes embedded processor blocks, RocketIO multi‑gigabit transceiver technology and a broad set of FPGA architecture features documented in the Virtex‑II Pro product specification.

Key Features

  • Logic Capacity  Approximately 6,768 logic elements for implementing custom logic, control and data-path functions.
  • Embedded Memory  Approximately 0.52 Mbits of embedded memory (516,096 total RAM bits) for FIFOs, buffering and on‑chip storage.
  • I/O Density  348 I/O pins to support parallel interfaces, high‑pin‑count peripherals and board-level connectivity.
  • Package & Mounting  672‑ball FCBGA / 672‑BBGA package (672‑FCBGA, 27×27) in a surface‑mount form factor for compact board layouts.
  • Power  Core voltage supply range 1.425 V to 1.575 V to match system power rails and support stable core operation.
  • Operating Range & Grade  Commercial grade with operating temperature 0 °C to 85 °C.
  • Standards & Compliance  RoHS compliant.
  • Platform Capabilities  Virtex‑II Pro family features documented in the product specification include embedded PowerPC processor blocks (up to two on some family members), RocketIO multi‑gigabit transceivers, dedicated 18‑bit × 18‑bit multipliers, Digital Clock Manager (DCM) circuitry, SelectRAM™ memory hierarchy and Digitally Controlled Impedance (DCI) I/O options.

Typical Applications

  • Telecommunications & Datacomm: Implements protocol adaptation, parallel interface bridging and I/O aggregation leveraging the family’s multi‑gigabit transceiver and high I/O count.
  • Embedded Processing Systems: Supports offload and control tasks that benefit from on‑chip logic and the Virtex‑II Pro family’s processor block options and documented IP core support.
  • Prototyping & Platform Development: Useful for board‑level prototyping where a combination of moderate logic density, on‑chip memory and plentiful I/O are required.

Unique Advantages

  • Balanced Logic and Memory: Approximately 6,768 logic elements coupled with ~0.52 Mbits of embedded RAM provides a practical mix for control logic, state machines and local buffering without external memory for many use cases.
  • High I/O Count: 348 I/O pads allow flexible interfacing to parallel buses, ADC/DAC front ends, sensor arrays or high‑pin connectors.
  • Compact, Surface‑Mount Package: 672‑ball FCBGA (27×27) enables a compact PCB footprint while delivering high pin density for complex boards.
  • Platform Documentation: Ship‑level product specification for the Virtex‑II Pro family documents transceiver, processor and FPGA functional blocks and IP core/reference support to accelerate design integration.
  • Commercial Temperature Rating: Rated 0 °C to 85 °C for standard commercial applications and environments.
  • RoHS Compliant: Meets lead‑free and environmental compliance requirements for modern electronic manufacturing.

Why Choose XC2VP4-5FF672C?

The XC2VP4-5FF672C delivers a practical combination of logic resources, on‑chip memory and high I/O density in a compact FCBGA package, making it well suited to commercial embedded designs that require moderate programmable logic and extensive board connectivity. As part of the Virtex‑II Pro platform, it benefits from detailed product documentation covering processor blocks, transceiver technology and FPGA architectural features to help accelerate system integration.

This device is appropriate for design teams seeking a documented platform solution with a balanced resource set and commercial temperature operation. Its package, supply voltage range and RoHS compliance support mainstream manufacturing and assembly processes.

Request a quote or submit an inquiry to receive availability and pricing for XC2VP4-5FF672C and to discuss how this Virtex‑II Pro FPGA can fit your next design.

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