XC2VP4-5FG256I

The XC2VP4-5FG256I is an industrial-grade Virtex®-II Pro field programmable gate array (FPGA) supplied by AMD, delivered in a 256-ball FBGA (17×17) package for surface-mount assembly. Based on the Virtex-II Pro platform, the design targets applications that require a balance of logic capacity, embedded memory, and flexible I/O within a compact package.

With 6,768 logic elements, approximately 0.516 Mbits of embedded RAM and 140 user I/Os, this device is suited for embedded processing, I/O-dense designs and industrial applications where operating range and integration are key considerations.

Key Features

• Logic Capacity  6,768 logic elements provide a practical balance of combinational and sequential resources for mid-range FPGA designs.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM to support buffering, small lookup tables and state storage without external memory.
• I/O Density  140 user I/Os accommodate multi-channel interfaces and board-level connectivity for sensor, control and peripheral signals.
• Supply Voltage  Core supply range of 1.425 V to 1.575 V for predictable power provisioning and integration with regulated supplies.
• Package & Mounting  256-FBGA (17×17) package in a surface-mount form factor for compact PCB layouts and high pin density.
• Industrial Temperature Range  Rated for operation from –40 °C to 100 °C to meet a wide range of industrial environmental conditions.
• Regulatory  RoHS compliant to support lead-free assembly processes and regulatory requirements.
• Virtex-II Pro Family Capabilities (Series)  The Virtex-II Pro family includes platform features such as embedded processor blocks and RocketIO multi-gigabit transceiver support, enabling system-level integration where applicable to the family members.

Typical Applications

• Industrial Control & Automation  Industrial-grade temperature range and high I/O count make the device suitable for motor control, PLC I/O expansion and factory-automation interfaces.
• Embedded Processing Systems  Logic capacity and embedded memory support custom control logic, protocol bridging and local processing tasks in embedded platforms.
• Communication Interfaces  High I/O density and family-level transceiver capabilities (where used in the Virtex‑II Pro family) support board-level protocol interfacing and data routing.

Unique Advantages

• Compact, high-density package  256-FBGA (17×17) reduces PCB area while providing ample I/O for complex interconnects.
• Industrial operating range  Rated –40 °C to 100 °C for deployment in temperature-challenging environments.
• Integrated on-chip memory  Approximately 0.516 Mbits of embedded RAM reduces reliance on external memory for small buffers and state machines.
• Balanced logic resource set  6,768 logic elements enable mid-range FPGA implementations without excessive overhead.
• RoHS compliant  Supports modern lead-free manufacturing and environmental requirements.
• Predictable power specification  Defined core voltage range (1.425 V–1.575 V) simplifies power-supply design and qualification.

Why Choose XC2VP4-5FG256I?

The XC2VP4-5FG256I positions itself as a practical Virtex®-II Pro platform device for engineers who need a compact, industrial-grade FPGA with a balanced mix of logic, embedded RAM and I/O. Its package density and operating temperature range make it a suitable choice for boards where space, thermal margin and connectivity are important.

For designs that leverage the Virtex‑II Pro family capabilities—such as embedded processing blocks and high-speed transceiver support at the family level—this device offers a cost-effective middle ground between basic FPGAs and larger platform devices, enabling scalable development and reuse across related designs.

Request a quote or submit an inquiry to receive pricing, lead-time information and availability for the XC2VP4-5FG256I. Our team can assist with part provisioning and integration guidance for your project needs.