XC2VP4-5FGG256C

IC FPGA 140 I/O 256FBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 140 516096 6768 256-BGA

Quantity 390 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O140Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs752Number of Logic Elements/Cells6768
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of XC2VP4-5FGG256C – Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 140 516096 6768 256-BGA

The XC2VP4-5FGG256C is a Virtex-II Pro platform FPGA in a 256-ball BGA package designed for commercial-grade embedded and high-performance I/O applications. It combines FPGA fabric density with family-level capabilities from the Virtex‑II Pro platform to support embedded processing and high-speed interfacing in compact surface-mount form factors.

This device is specified with 752 CLBs (providing 6,768 logic elements), approximately 0.52 Mbits of embedded memory, 140 user I/O pins, and electrical/thermal ratings suited for commercial designs.

Key Features

  • Virtex‑II Pro platform architecture Family features include FPGA fabric and platform capabilities targeted at embedded processing and high-speed serial applications.
  • Logic resources 752 CLBs delivering 6,768 logic elements for combinational and sequential logic implementation.
  • On-chip memory Approximately 0.52 Mbits of embedded RAM (516,096 bits) for data buffering, FIFOs, and small lookup tables.
  • I/O and package 140 user I/O pins in a 256-ball fine-pitch BGA (256-FBGA, 17×17) surface-mount package for dense board integration.
  • Power and thermal Core supply voltage range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C suitable for commercial applications.
  • Signal processing primitives Family-level resources include 18‑bit × 18‑bit multiplier blocks and clock management circuitry to support arithmetic and timing functions.
  • Embedded processing and transceiver support (family-level) Virtex‑II Pro family documentation describes support for embedded PowerPC processor blocks and RocketIO multi‑gigabit transceivers for designs that require on-chip processing and serial links.
  • Compliance and mounting Surface-mount 256-FBGA package and RoHS-compliant status for regulatory and assembly compatibility.

Typical Applications

  • Embedded processing platforms FPGA fabric density and family support for embedded processor blocks make the device suitable for on-board control and real-time processing tasks.
  • High-density I/O subsystems 140 user I/O pins in a compact 256‑FBGA package support multi-channel interfaces and mid-density connector arrays on space-constrained PCBs.
  • Data buffering and signal logic On-chip RAM and multiplier resources enable data path buffering, small FIFOs, and arithmetic acceleration for signal conditioning or control loops.
  • Commercial networking and communications Family-level RocketIO and clock management features support designs requiring structured serial links and robust timing management.

Unique Advantages

  • Balanced logic and memory 6,768 logic elements paired with approximately 0.52 Mbits of embedded RAM provides a compact balance of combinational logic and local storage.
  • Compact BGA integration 256-FBGA (17×17) surface-mount package offers a high-pin-count, board-friendly footprint for dense designs.
  • Commercial temperature and supply specifications Clear electrical and thermal limits (1.425 V–1.575 V supply, 0 °C–85 °C operation) simplify selection for commercial product lines.
  • RoHS compliant Environmentally compliant status supports modern assembly and regulatory requirements.
  • Platform extensibility Leveraging Virtex‑II Pro family features such as embedded processor and multi‑gigabit transceiver support enables migration within the platform where those capabilities are required.

Why Choose XC2VP4-5FGG256C?

The XC2VP4-5FGG256C provides a practical combination of FPGA logic density, on-chip RAM, and a high-density BGA package for commercial embedded and I/O-focused designs. Its specification set—6,768 logic elements, approximately 0.52 Mbits of embedded memory, 140 I/O pins, and standard commercial operating and supply ranges—makes it suitable for developers needing compact, board-level programmable logic with clear electrical and thermal limits.

Chosen for designs that require mid-level logic capacity and compact integration, this device offers predictable platform features and RoHS compliance that support production assemblies and long-term maintenance within the Virtex‑II Pro family ecosystem.

Request a quote or submit your requirements to receive pricing and availability for the XC2VP4-5FGG256C. Our team will respond with lead time and ordering options tailored to your project needs.

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