XC2VP4-5FGG256C
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 140 516096 6768 256-BGA |
|---|---|
| Quantity | 390 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 140 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 752 | Number of Logic Elements/Cells | 6768 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of XC2VP4-5FGG256C – Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 140 516096 6768 256-BGA
The XC2VP4-5FGG256C is a Virtex-II Pro platform FPGA in a 256-ball BGA package designed for commercial-grade embedded and high-performance I/O applications. It combines FPGA fabric density with family-level capabilities from the Virtex‑II Pro platform to support embedded processing and high-speed interfacing in compact surface-mount form factors.
This device is specified with 752 CLBs (providing 6,768 logic elements), approximately 0.52 Mbits of embedded memory, 140 user I/O pins, and electrical/thermal ratings suited for commercial designs.
Key Features
- Virtex‑II Pro platform architecture Family features include FPGA fabric and platform capabilities targeted at embedded processing and high-speed serial applications.
- Logic resources 752 CLBs delivering 6,768 logic elements for combinational and sequential logic implementation.
- On-chip memory Approximately 0.52 Mbits of embedded RAM (516,096 bits) for data buffering, FIFOs, and small lookup tables.
- I/O and package 140 user I/O pins in a 256-ball fine-pitch BGA (256-FBGA, 17×17) surface-mount package for dense board integration.
- Power and thermal Core supply voltage range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C suitable for commercial applications.
- Signal processing primitives Family-level resources include 18‑bit × 18‑bit multiplier blocks and clock management circuitry to support arithmetic and timing functions.
- Embedded processing and transceiver support (family-level) Virtex‑II Pro family documentation describes support for embedded PowerPC processor blocks and RocketIO multi‑gigabit transceivers for designs that require on-chip processing and serial links.
- Compliance and mounting Surface-mount 256-FBGA package and RoHS-compliant status for regulatory and assembly compatibility.
Typical Applications
- Embedded processing platforms FPGA fabric density and family support for embedded processor blocks make the device suitable for on-board control and real-time processing tasks.
- High-density I/O subsystems 140 user I/O pins in a compact 256‑FBGA package support multi-channel interfaces and mid-density connector arrays on space-constrained PCBs.
- Data buffering and signal logic On-chip RAM and multiplier resources enable data path buffering, small FIFOs, and arithmetic acceleration for signal conditioning or control loops.
- Commercial networking and communications Family-level RocketIO and clock management features support designs requiring structured serial links and robust timing management.
Unique Advantages
- Balanced logic and memory 6,768 logic elements paired with approximately 0.52 Mbits of embedded RAM provides a compact balance of combinational logic and local storage.
- Compact BGA integration 256-FBGA (17×17) surface-mount package offers a high-pin-count, board-friendly footprint for dense designs.
- Commercial temperature and supply specifications Clear electrical and thermal limits (1.425 V–1.575 V supply, 0 °C–85 °C operation) simplify selection for commercial product lines.
- RoHS compliant Environmentally compliant status supports modern assembly and regulatory requirements.
- Platform extensibility Leveraging Virtex‑II Pro family features such as embedded processor and multi‑gigabit transceiver support enables migration within the platform where those capabilities are required.
Why Choose XC2VP4-5FGG256C?
The XC2VP4-5FGG256C provides a practical combination of FPGA logic density, on-chip RAM, and a high-density BGA package for commercial embedded and I/O-focused designs. Its specification set—6,768 logic elements, approximately 0.52 Mbits of embedded memory, 140 I/O pins, and standard commercial operating and supply ranges—makes it suitable for developers needing compact, board-level programmable logic with clear electrical and thermal limits.
Chosen for designs that require mid-level logic capacity and compact integration, this device offers predictable platform features and RoHS compliance that support production assemblies and long-term maintenance within the Virtex‑II Pro family ecosystem.
Request a quote or submit your requirements to receive pricing and availability for the XC2VP4-5FGG256C. Our team will respond with lead time and ordering options tailored to your project needs.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








