XC2VP4-6FF672C

The XC2VP4-6FF672C is a Virtex®-II Pro field programmable gate array (FPGA) in a 672-FCBGA package intended for commercial applications. This device combines configurable logic, significant embedded memory, and a large I/O complement to support embedded processing, high-speed interfacing, and complex custom logic functions.

As a member of the Virtex‑II Pro family, the device leverages platform-level capabilities such as on-chip processor blocks and multi‑gigabit transceiver support available across the family, enabling designs that require integration of processing and high-speed serial interfaces.

Key Features

• Logic Capacity – 752 CLBs and 6,768 logic cells provide programmable logic resources for control, glue logic, and custom datapaths.
• On-Chip Memory – 516,096 bits (approximately 0.52 Mbits) of embedded RAM to store buffers, FIFOs, and state data.
• I/O Density – 348 general-purpose I/O pins to support multi-channel interfaces and parallel buses.
• Power and Thermal – Core supply range 1.425 V to 1.575 V with commercial operating temperature 0 °C to 85 °C.
• Package & Mounting – 672‑FCBGA (27×27) package, surface-mount mounting for compact, high-density board designs.
• RoHS Compliant – Environmentally compliant manufacturing status.
• Family-Level Platform Features – Virtex‑II Pro family capabilities include embedded PowerPC processor blocks, RocketIO multi‑gigabit transceivers, dedicated 18×18 multipliers, SelectRAM+ memory hierarchy, DCM clock management, SelectI/O‑Ultra and digitally controlled impedance (DCI) I/O (as documented for the Virtex‑II Pro family).

Typical Applications

• Embedded Processing Systems – Integrate programmable logic with on‑chip processor blocks (family feature) for system‑on‑chip designs and control tasks.
• Telecom & Datacom – Family support for RocketIO transceivers and telecom/datacom modes enables implementation of serial link interfaces and protocol logic.
• Digital Signal Processing – Dedicated 18×18 multipliers and on‑chip RAM are suited for filtering, transform, and DSP acceleration functions.
• High‑Density I/O Control – 348 I/O pins allow aggregation of parallel interfaces, sensors, or multi‑lane data capture systems.

Unique Advantages

• Balanced Logic and Memory – Combination of 752 CLBs and approximately 0.52 Mbits of embedded RAM supports both control logic and local data buffering without external memory for many use cases.
• High I/O Count – 348 I/O pins provide flexibility to connect multiple peripherals, parallel data buses, or high‑pin-count interfaces on a single device.
• Compact, High‑Density Package – 672‑FCBGA (27×27) package delivers a high pin count in a compact footprint suitable for space-constrained PCBs.
• Commercial Temperature Rating – 0 °C to 85 °C operating range matches typical commercial embedded and communications applications.
• Platform-Level Integration – As part of the Virtex‑II Pro family, the device benefits from documented features such as processor blocks, RocketIO transceivers, clock management, and IP/core reference support.
• Regulatory Compliance – RoHS compliance supports regulatory and environmental requirements for commercial products.

Why Choose XC2VP4-6FF672C?

The XC2VP4-6FF672C offers a practical mix of programmable logic, embedded RAM, and dense I/O in a 672‑FCBGA package, making it suitable for designers needing integrated processing and interfacing capabilities in commercial applications. Its placement in the Virtex‑II Pro family provides access to platform-level features and documentation that simplify development of systems with embedded processors and high‑speed serial links.

This device is well suited for engineering teams building communications, embedded control, and DSP‑oriented designs that require a balance of logic resources, on‑chip memory, and a high I/O count in a compact, surface‑mount package.

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