XC2VP4-6FFG672I

The XC2VP4-6FFG672I is a Virtex®-II Pro platform FPGA supplied in a 672-ball flip-chip BGA (672-FCBGA, 27×27) surface-mount package. It provides a balanced combination of configurable logic, embedded memory and high pin-count I/O for industrial-grade embedded applications.

Designed for systems that require extensive I/O and on-chip resources, this device offers 6,768 logic elements, approximately 0.5 Mbits of embedded RAM, and 348 user I/Os while supporting an industrial operating temperature range and RoHS compliance.

Key Features

• Configurable Logic Capacity – 6,768 logic elements for implementing custom digital functions and state machines.
• Embedded Memory – Approximately 0.5 Mbits (516,096 bits) of on-chip RAM to support buffering, FIFOs and small data tables.
• I/O Density – 348 user I/Os to connect a wide range of peripherals, sensors and external devices directly to the FPGA.
• Power Supply – Core voltage range 1.425 V to 1.575 V to match board-level power design requirements.
• Package and Mounting – 672-BBGA, flip-chip BGA (672-FCBGA, 27×27) in a surface-mount form factor for compact board integration.
• Temperature Range – Industrial operating range from −40 °C to 100 °C for deployment in demanding environments.
• Industrial Grade – Specified as Industrial grade for use in commercial and industrial systems requiring extended temperature operation.
• Environmental Compliance – RoHS compliant to meet modern assembly and disposal requirements.
• Virtex-II Pro Platform – Built on the Virtex-II Pro platform; the family-level specification includes platform features such as embedded processor block options and RocketIO transceiver options (family-level features described in the product datasheet).

Typical Applications

• Industrial Control – Use the device’s industrial temperature rating and high I/O count for machine control, motor drives and automation interfaces.
• High-Performance Embedded Systems – Implement custom logic, protocol handling and system glue with the device’s logic capacity and on-chip memory.
• Data Communications – Leverage the Virtex-II Pro platform architecture for applications that require dense I/O and platform-level multi-gigabit transceiver support (family-level).
• Custom Hardware Acceleration – Offload compute tasks or implement application-specific accelerators using the available logic and embedded RAM resources.

Unique Advantages

• High I/O Count: 348 user I/Os simplify board-level routing and reduce the need for external interface bridges.
• Balanced Logic and Memory: 6,768 logic elements paired with approximately 0.5 Mbits of embedded RAM provide a practical mix for control, buffering and small-data applications.
• Industrial Operating Envelope: Specified for −40 °C to 100 °C, enabling deployment in industrial environments with wide temperature swings.
• Standard FCBGA Package: 672-FCBGA (27×27) flip-chip BGA offers a compact, board-friendly footprint for dense system designs.
• Platform-Level Flexibility: Integration within the Virtex-II Pro family provides access to platform capabilities documented in the product datasheet, supporting system designers who need processor or transceiver options at the family level.
• Regulatory and Assembly Alignment: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose XC2VP4-6FFG672I?

The XC2VP4-6FFG672I positions itself as a practical choice for industrial and embedded systems that require a balanced mix of logic resources, embedded RAM and a high number of I/Os in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for robust deployments where environmental and regulatory factors matter.

Engineers building mid-range FPGA-based systems will find the device useful for custom protocol handling, interface consolidation and hardware acceleration tasks, benefitting from the Virtex-II Pro platform capabilities documented in the product literature.

Request a quote or submit an inquiry to check pricing and availability for the XC2VP4-6FFG672I and to discuss how it fits your next design.