XC2VP4-6FF672I

The XC2VP4-6FF672I is a Virtex®-II Pro field programmable gate array (FPGA) in a 672‑ball flip-chip BGA (FCBGA) package, intended for surface-mount applications. It provides a balance of configurable logic, embedded memory, and high I/O count for designs that require flexible, reprogrammable digital logic in industrial operating environments.

Key physical and electrical characteristics include a 672‑FCBGA (27×27) footprint, a core supply range of 1.425 V to 1.575 V, and an industrial operating temperature range of −40 °C to 100 °C, with RoHS compliance for environmental compatibility.

Key Features

• Configurable Logic Capacity — 6,768 logic elements for implementing custom logic, state machines, and glue logic in reprogrammable silicon.
• Embedded Memory — Approximately 0.52 Mbits of on-chip RAM (516,096 total RAM bits) for buffering, FIFOs, and small lookup tables.
• High I/O Count — Up to 348 user I/O pins to support multiple parallel interfaces and board-level connectivity.
• Package and Mounting — 672‑FCBGA (27×27) supplier device package in a surface-mount form factor for compact, high-density layouts.
• Power and Voltage — Core voltage supply specified from 1.425 V to 1.575 V to support controlled power-rail design.
• Industrial Temperature Rating — Qualified for operation from −40 °C to 100 °C to meet industrial deployment requirements.
• Compliance — RoHS compliant to meet modern environmental regulations.
• Series-Level Capabilities (per datasheet) — The Virtex-II Pro family documentation describes platform features such as embedded processor blocks and multi‑gigabit transceiver options available across the family.

Typical Applications

• Embedded Processing and Control — Implements custom control logic and glue logic for industrial controllers and embedded systems using reprogrammable logic resources.
• High‑Density I/O Systems — Serves as an interface hub where many parallel or multiplexed signals require programmable I/O mapping and timing control.
• Communications Equipment — Suitable for telecom/datacom line cards and networking modules that require flexible protocol handling and multiple I/O interfaces.
• Prototype and Development Platforms — Provides a reprogrammable platform for validating digital designs and integrating custom peripherals during development.

Unique Advantages

• Balanced Integration: Combines several thousand logic elements with embedded RAM and 348 I/Os for mid‑complexity FPGA designs without external glue logic.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, supporting deployments in industrial temperature environments.
• Compact High‑Pin Package: 672‑ball FCBGA (27×27) delivers high I/O density in a compact footprint for space‑constrained PCBs.
• Controlled Power Envelope: Narrow core voltage window (1.425 V–1.575 V) enables predictable power delivery and planning.
• Compliance and Sourcing: RoHS compliance supports environmentally conscious product builds and supply continuity.
• Documented Platform Features: The Virtex‑II Pro family datasheet provides detailed guidance on architecture and available family features for design planning.

Why Choose XC2VP4-6FF672I?

The XC2VP4-6FF672I positions itself as a practical Virtex®-II Pro family member for designers needing reprogrammable logic with moderate capacity, substantial I/O, and embedded memory, all within an industrial temperature envelope. Its 672‑FCBGA package enables high pin count in a compact board footprint, while the defined core voltage and RoHS compliance aid predictable integration and regulatory alignment.

This device is appropriate for teams designing industrial control, communications, and high‑density I/O systems who require a documented FPGA platform and the flexibility of in-system reconfiguration.

Request a quote or contact sales to discuss availability, lead times, and to obtain ordering information for the XC2VP4-6FF672I.