XC2VP4-5FGG456C
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 248 516096 6768 456-BBGA |
|---|---|
| Quantity | 1,606 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 248 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 752 | Number of Logic Elements/Cells | 6768 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of XC2VP4-5FGG456C – Virtex®-II Pro FPGA, 456-BBGA, 248 I/O
The XC2VP4-5FGG456C is a Virtex®-II Pro Field Programmable Gate Array (FPGA) in a 456-BBGA package. It provides approximately 6,768 logic elements, 248 user I/O, and approximately 0.516 Mbits of on-chip RAM (516,096 bits) in a surface-mount, 456-FBGA (23×23) footprint.
As a member of the Virtex-II Pro family, the device is based on platform FPGA technology and aligns with family-level capabilities such as embedded processor blocks, RocketIO multi-gigabit transceiver support, dedicated multiplier resources, and advanced clock management circuitry. The part is specified for a core supply of 1.425 V to 1.575 V and commercial operating temperatures from 0 °C to 85 °C, and it is RoHS compliant.
Key Features
- Device Type & Architecture Virtex®-II Pro platform FPGA architecture with SRAM-based in-system configuration and Active Interconnect technology (family-level features).
- Logic Resources Approximately 6,768 logic elements for implementing custom digital logic and control functions.
- Embedded Memory Approximately 0.516 Mbits of on-chip RAM (516,096 total RAM bits) for buffering, tables, and small data stores.
- I/O & Package 248 user I/O in a 456-BBGA package; supplier device package listed as 456-FBGA (23×23). Surface-mount mounting type simplifies PCB assembly.
- Power & Thermal Core voltage defined at 1.425 V to 1.575 V; commercial operating temperature range of 0 °C to 85 °C.
- Embedded Processing & High-Speed SerDes (family-level) Virtex-II Pro family supports up to two IBM PowerPC™ RISC processor blocks and up to twenty RocketIO™ Multi-Gigabit Transceivers (MGTs) for integrated processing and high-speed serial links.
- DSP & Clocking (family-level) Dedicated 18-bit × 18-bit multiplier blocks and Digital Clock Manager (DCM) resources for arithmetic acceleration and clock management.
- Regulatory RoHS compliant for lead-free manufacturing processes.
Typical Applications
- Telecommunications & Datacom Use in systems that require high-density I/O and family-level RocketIO support for serial links and protocol bridging.
- Embedded Processing Integration of on-chip processor cores (family-level PowerPC support) and custom logic for control, protocol handling, or offload tasks.
- Prototyping & System Integration In-system configurability and a compact 456-BBGA footprint make the device suitable for board-level integration and iterative design.
- Digital Signal Processing On-chip multiplier blocks and local RAM support DSP pipelines and arithmetic-intensive functions.
Unique Advantages
- High I/O density: 248 user I/O simplifies complex board-level interfacing without external IO expanders.
- Integrated on-chip memory: Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for small buffers and lookup tables.
- Compact BGA package: 456-BBGA / 456-FBGA (23×23) offers a balanced footprint for space-constrained PCBs while retaining a high pin count.
- Family-enabled processing & serial links: Support for embedded PowerPC cores and RocketIO MGTs (family features) enables tighter integration of processing and high-speed serial interfaces.
- Commercial-grade, RoHS compliant: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
- Defined core voltage range: 1.425 V to 1.575 V core supply simplifies power supply selection and design margins.
Why Choose XC2VP4-5FGG456C?
The XC2VP4-5FGG456C offers a balanced combination of logic density, embedded memory, and high I/O count in a compact 456-BBGA package. As part of the Virtex®-II Pro family, it aligns with platform-level capabilities—such as embedded processor blocks, RocketIO transceivers, dedicated multipliers, and advanced clock management—that suit designs requiring integrated processing and high-speed interfaces.
This device is well suited for commercial embedded systems, communications equipment, and platform prototypes where on-chip memory, moderate logic resources, and extensive I/O are important. Its RoHS compliance and defined operating voltage and temperature ranges support standard commercial product development and manufacturing.
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Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








