XC2VP4-5FGG456C

IC FPGA 248 I/O 456FBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 248 516096 6768 456-BBGA

Quantity 1,606 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case456-BBGANumber of I/O248Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs752Number of Logic Elements/Cells6768
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of XC2VP4-5FGG456C – Virtex®-II Pro FPGA, 456-BBGA, 248 I/O

The XC2VP4-5FGG456C is a Virtex®-II Pro Field Programmable Gate Array (FPGA) in a 456-BBGA package. It provides approximately 6,768 logic elements, 248 user I/O, and approximately 0.516 Mbits of on-chip RAM (516,096 bits) in a surface-mount, 456-FBGA (23×23) footprint.

As a member of the Virtex-II Pro family, the device is based on platform FPGA technology and aligns with family-level capabilities such as embedded processor blocks, RocketIO multi-gigabit transceiver support, dedicated multiplier resources, and advanced clock management circuitry. The part is specified for a core supply of 1.425 V to 1.575 V and commercial operating temperatures from 0 °C to 85 °C, and it is RoHS compliant.

Key Features

  • Device Type & Architecture  Virtex®-II Pro platform FPGA architecture with SRAM-based in-system configuration and Active Interconnect technology (family-level features).
  • Logic Resources  Approximately 6,768 logic elements for implementing custom digital logic and control functions.
  • Embedded Memory  Approximately 0.516 Mbits of on-chip RAM (516,096 total RAM bits) for buffering, tables, and small data stores.
  • I/O & Package  248 user I/O in a 456-BBGA package; supplier device package listed as 456-FBGA (23×23). Surface-mount mounting type simplifies PCB assembly.
  • Power & Thermal  Core voltage defined at 1.425 V to 1.575 V; commercial operating temperature range of 0 °C to 85 °C.
  • Embedded Processing & High-Speed SerDes (family-level)  Virtex-II Pro family supports up to two IBM PowerPC™ RISC processor blocks and up to twenty RocketIO™ Multi-Gigabit Transceivers (MGTs) for integrated processing and high-speed serial links.
  • DSP & Clocking (family-level)  Dedicated 18-bit × 18-bit multiplier blocks and Digital Clock Manager (DCM) resources for arithmetic acceleration and clock management.
  • Regulatory  RoHS compliant for lead-free manufacturing processes.

Typical Applications

  • Telecommunications & Datacom  Use in systems that require high-density I/O and family-level RocketIO support for serial links and protocol bridging.
  • Embedded Processing  Integration of on-chip processor cores (family-level PowerPC support) and custom logic for control, protocol handling, or offload tasks.
  • Prototyping & System Integration  In-system configurability and a compact 456-BBGA footprint make the device suitable for board-level integration and iterative design.
  • Digital Signal Processing  On-chip multiplier blocks and local RAM support DSP pipelines and arithmetic-intensive functions.

Unique Advantages

  • High I/O density: 248 user I/O simplifies complex board-level interfacing without external IO expanders.
  • Integrated on-chip memory: Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for small buffers and lookup tables.
  • Compact BGA package: 456-BBGA / 456-FBGA (23×23) offers a balanced footprint for space-constrained PCBs while retaining a high pin count.
  • Family-enabled processing & serial links: Support for embedded PowerPC cores and RocketIO MGTs (family features) enables tighter integration of processing and high-speed serial interfaces.
  • Commercial-grade, RoHS compliant: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
  • Defined core voltage range: 1.425 V to 1.575 V core supply simplifies power supply selection and design margins.

Why Choose XC2VP4-5FGG456C?

The XC2VP4-5FGG456C offers a balanced combination of logic density, embedded memory, and high I/O count in a compact 456-BBGA package. As part of the Virtex®-II Pro family, it aligns with platform-level capabilities—such as embedded processor blocks, RocketIO transceivers, dedicated multipliers, and advanced clock management—that suit designs requiring integrated processing and high-speed interfaces.

This device is well suited for commercial embedded systems, communications equipment, and platform prototypes where on-chip memory, moderate logic resources, and extensive I/O are important. Its RoHS compliance and defined operating voltage and temperature ranges support standard commercial product development and manufacturing.

Request a quote or submit a purchase inquiry to evaluate XC2VP4-5FGG456C for your next design project.

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