XC2VP4-5FG456I

The XC2VP4-5FG456I is an AMD Virtex®-II Pro platform FPGA supplied in a 456-ball BGA package. It integrates programmable logic, on-chip memory, and a high-density I/O complement for embedded processing and system-level interfacing.

Based on the Virtex-II Pro family architecture, the device supports features described for the platform such as multi-gigabit transceiver capability and embedded processor block options at the family level, while providing industrial-grade operating range and RoHS compliance for reliable deployment.

Key Features

• Logic Capacity — 752 CLBs and 6,768 logic elements provide a programmable fabric for custom digital logic and control implementations.
• On-Chip Memory — Approximately 0.516 Mbits of embedded memory (516,096 bits) for buffering, lookup tables, and temporary storage.
• I/O Density — 248 general-purpose I/O pins to support broad board-level interfacing and system connectivity.
• Package and Mounting — 456-ball BGA (456-BBGA) surface-mount package; supplier device package listed as 456-FBGA (23×23).
• Power — Core supply voltage range of 1.425 V to 1.575 V to match system power rails.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for use in industrial environments.
• Regulatory — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Telecommunications & Datacom — Family-level support for RocketIO/RocketIO X multi-gigabit transceivers and telecom/datacom modes enables high-speed serial links and protocol implementations.
• Embedded Processing — Virtex-II Pro platform includes processor block options (e.g., PowerPC cores at family level) for integrating application-specific processing with programmable logic.
• High-Density I/O Systems — The 248 I/O pins and BGA form factor suit board-level systems requiring multiple interface channels and compact routing.
• Signal Processing & Acceleration — Dedicated multiplier and block RAM resources at the family level support DSP functions and custom acceleration kernels.

Unique Advantages

• Platform-Level Integration: Virtex-II Pro family features such as embedded processor blocks and multi-gigabit transceivers (documented at the family level) reduce the need for separate processor or PHY components.
• Programmable Logic Density: 752 CLBs and 6,768 logic elements allow flexible implementation of medium-complexity designs while maintaining tight board integration.
• Compact, Serviceable Package: 456-ball BGA (23×23) provides a high-pin-count, surface-mount footprint suitable for space-constrained PCBs.
• Industrial Reliability: −40 °C to 100 °C operating range and RoHS compliance support deployment in industrial environments with environmental and regulatory considerations.
• Tight Power Specification: Defined core voltage range (1.425 V to 1.575 V) helps simplify power supply design and margin planning.

Why Choose XC2VP4-5FG456I?

The XC2VP4-5FG456I positions itself as a Virtex-II Pro platform FPGA option that combines configurable logic density, on-chip memory, and a high I/O count in a single industrial-grade BGA package. It is suited to designers who require a programmable platform with family-level capabilities for embedded processing and high-speed serial connectivity while keeping board area and component count under control.

This device is appropriate for development and production designs where industrial temperature range, a defined core supply, and RoHS compliance are key procurement criteria. The product leverages the Virtex-II Pro family architecture to provide a balanced mix of logic resources, memory, and connectivity for mid-range FPGA applications.

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