XC2VP4-5FGG456I

The XC2VP4-5FGG456I is a Virtex®-II Pro platform FPGA offered by AMD. It integrates configurable logic, embedded memory, and a high pin-count I/O interface in a 456-ball BGA package intended for industrial applications.

Built on the Virtex-II Pro family architecture, the device targets designs that require a combination of programmable logic, substantial on-chip memory, and extensive I/O connectivity, while supporting industrial temperature operation and surface-mount assembly.

Key Features

• Logic Capacity  Approximately 6,768 logic elements distributed across 752 CLBs, enabling complex programmable logic implementations.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM (516,096 bits) for data buffering, state storage, and embedded memory functions.
• I/O Density  Up to 248 user I/O pins to support wide parallel interfaces and dense external connectivity.
• On-Chip Processing and High-Speed Interfaces  Virtex-II Pro family features include support for embedded processor blocks and multi-gigabit transceiver technology as part of the platform architecture.
• Dedicated DSP Resources  Family architecture includes 18-bit × 18-bit multiplier blocks for hardware-accelerated arithmetic operations.
• Clock Management  Includes high-performance clock management circuitry such as Digital Clock Manager (DCM) for flexible clocking options (feature described in family datasheet).
• Package and Mounting  456-ball BGA package (supplier device package listed as 456-FBGA, 23 × 23) in a surface-mount form factor for compact board-level integration.
• Power  Core supply voltage range specified at 1.425 V to 1.575 V to meet system power requirements.
• Temperature Grade  Industrial operating temperature range from -40 °C to 100 °C for use in temperature-challenging environments.
• Standards & Compliance  RoHS-compliant material status to support environmental and regulatory requirements.

Typical Applications

• Telecommunications and Datacom  Leverages the Virtex-II Pro family’s multi-gigabit transceiver and high I/O count to implement serial links, protocol bridging, and packet processing functions.
• Embedded Processing Platforms  Family support for embedded processor blocks makes the device suitable for integrating control and real-time processing alongside programmable logic.
• Industrial Control and Automation  Industrial temperature rating and extensive I/O make the device suitable for sensor interfacing, motor control logic, and factory automation systems.
• FPGA-Based Prototyping and Custom Hardware  Programmable logic capacity and on-chip RAM support hardware emulation, algorithm acceleration, and custom peripheral integration.

Unique Advantages

• Balanced Logic and Memory  Combines roughly 6,768 logic elements with approximately 0.516 Mbits of embedded RAM to support both control logic and data buffering on a single device.
• High I/O Count  A 248-pin I/O interface simplifies system-level connectivity and reduces the need for external glue logic.
• Industrial Temperature Range  Rated for -40 °C to 100 °C operation, enabling deployment in temperature-demanding environments.
• Compact BGA Footprint  456-ball FBGA package (23 × 23) provides high integration density for space-constrained boards.
• Family-Level Integration Options  Virtex-II Pro family capabilities such as embedded processor blocks, multi-gigabit transceivers, dedicated multipliers, and advanced clock management offer a platform for integrating diverse system functions.
• Regulatory Compliance  RoHS-compliant construction supports product rollouts that require lead-free materials.

Why Choose XC2VP4-5FGG456I?

The XC2VP4-5FGG456I positions itself as a versatile Virtex-II Pro platform FPGA suitable for designs that need a mix of programmable logic, embedded memory, and substantial I/O in an industrial-temperature, surface-mount package. Its combination of logic capacity, on-chip RAM, and family-level features provides designers with a solid foundation for implementing embedded processing, high-speed interfaces, and complex control logic.

This device is appropriate for engineering teams and procurement organizations seeking an FPGA solution with clear, verifiable specifications for power, temperature, packaging, and I/O density—helping streamline board-level integration and reduce external component count.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the XC2VP4-5FGG456I. Include your required quantities and lead-time needs to expedite a response.