XC2VP4-5FG256C

IC FPGA 140 I/O 256FBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 140 516096 6768 256-BGA

Quantity 170 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O140Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level2A (4 Weeks)Number of LABs/CLBs752Number of Logic Elements/Cells6768
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of XC2VP4-5FG256C – Virtex®-II Pro FPGA, 256-BGA

The XC2VP4-5FG256C is a Virtex®-II Pro field programmable gate array (FPGA) in a 256-ball BGA package designed for surface-mount applications. Built on the Virtex-II Pro platform, the device combines configurable logic, embedded memory, and platform-level features suitable for embedded processing and system integration tasks.

This commercial-grade FPGA targets designs that require moderate logic capacity, flexible I/O, and on-chip RAM for buffering and local data storage, while operating within standard commercial temperature and supply ranges.

Key Features

  • Logic Capacity  Approximately 6,768 logic elements organized across 752 CLBs (Configurable Logic Blocks), enabling mid-density logic implementations.
  • Embedded Memory  Approximately 0.52 Mbits of embedded RAM (516,096 total RAM bits) for data buffering, state storage, and small on-chip memory structures.
  • I/O and Package  140 user I/O pins in a 256-ball BGA package (supplier package: 256-FBGA, 17×17 mm), optimized for surface-mount PCB assembly.
  • Power and Temperature  Core supply range 1.425 V to 1.575 V; commercial operating temperature range 0 °C to 85 °C.
  • On-chip DSP Primitives  Device family features include dedicated 18-bit × 18-bit multiplier blocks for arithmetic acceleration (family-level capability documented in product literature).
  • Platform Capabilities (Family)  Virtex-II Pro platform features noted in the product specification include PowerPC processor block support, RocketIO multi-gigabit transceivers, SelectRAM+ memory hierarchy, and digitally controlled impedance (DCI) I/O (family-level capabilities described in the datasheet).
  • Mounting and Compliance  Surface mount device with RoHS compliance for lead-free assembly processes.

Typical Applications

  • Embedded Systems  Integrate configurable logic with on-chip memory for control, data preprocessing, and system glue logic in embedded controllers and appliances.
  • Communications Modules  Leverage the Virtex-II Pro platform features for designs that require serial link support and protocol bridging (family-level transceiver and telecom/datacom modes are documented in the device literature).
  • Signal Processing Acceleration  Use the device’s multipliers and embedded RAM to implement mid-range DSP functions and arithmetic-heavy blocks.

Unique Advantages

  • Integrated Logic and Memory  Combines 6,768 logic elements with approximately 0.52 Mbits of on-chip RAM to reduce external memory dependence for many control and buffering tasks.
  • Balanced I/O and Packaging  140 I/O pins in a compact 256-FBGA (17×17) package provide a practical balance between PCB real estate and connectivity.
  • Platform Feature Set  As part of the Virtex-II Pro family, designers can access platform-level capabilities such as processor block integration and multi-gigabit transceiver support as documented in the datasheet.
  • Commercial Temperature and Supply  Standard commercial temperature rating (0 °C to 85 °C) and defined core supply window (1.425 V–1.575 V) simplify power and thermal planning for mainstream applications.
  • RoHS Compliant  Lead-free compliant device suitable for assemblies requiring RoHS conformance.

Why Choose XC2VP4-5FG256C?

The XC2VP4-5FG256C offers a practical Virtex-II Pro platform option for designs that need a combination of configurable logic, embedded RAM, and a solid I/O count in a compact surface-mount package. Its documented family-level features—such as on-chip multipliers and processor/serial-transceiver support—make it a suitable choice for embedded processing, communications modules, and mid-density DSP tasks where platform integration matters.

Engineers and procurement teams seeking a commercial-grade FPGA with clear electrical and thermal parameters, RoHS compliance, and access to the Virtex-II Pro product documentation will find the XC2VP4-5FG256C appropriate for projects requiring moderate logic capacity and integration.

Request a quote or submit an inquiry to receive pricing, availability, and additional ordering information for the XC2VP4-5FG256C.

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