XC2VP4-5FG456C

The XC2VP4-5FG456C is a Virtex®-II Pro platform FPGA offering a compact, surface-mount BGA package and a balance of programmable logic, embedded memory, and I/O resources. Built on the Virtex-II Pro architecture, the device is intended for designs that require flexible logic resources, embedded memory, and extensive I/O connectivity.

Series documentation for the Virtex-II Pro family highlights platform capabilities such as embedded PowerPC processor blocks, RocketIO multi-gigabit transceiver support, on-chip DSP multipliers and advanced clock management — features that define the platform this device is a member of.

Key Features

• Core architecture Based on Virtex-II Pro platform FPGA technology with SRAM-based in-system configuration and Active Interconnect support as described in the series documentation.
• Logic capacity Approximately 6,768 logic elements to implement custom digital logic and control functions.
• Embedded memory Approximately 0.52 Mbits (516,096 bits) of on-chip RAM for data buffering, FIFOs, and local storage.
• I/O density 248 user I/O pins providing broad connectivity for interfaces and external peripherals.
• Platform transceiver support (series) Series documentation includes support for RocketIO™ and RocketIO X multi‑gigabit transceivers, and up to two embedded PowerPC processor blocks in family members.
• DSP and clocking resources (series) Series features include dedicated 18-bit × 18-bit multiplier blocks and Digital Clock Manager (DCM) resources for high-performance signal processing and clock control.
• Package & mounting 456-ball BGA (456-BBGA), supplier package 456-FBGA (23×23), designed for surface-mount assembly.
• Power and temperature Core supply range 1.425 V to 1.575 V; rated operating temperature 0 °C to 85 °C; commercial grade device.
• Regulatory RoHS compliant.

Unique Advantages

• Balanced logic and memory Combines approximately 6,768 logic elements with ~0.52 Mbits of embedded memory to implement medium-complexity FPGA functions with local storage.
• High I/O count in a compact package 248 I/O pins in a 456-ball BGA enable dense connectivity while keeping PCB footprint compact.
• Platform feature set As a member of the Virtex-II Pro family, the device leverages a platform architecture that includes DSP multipliers, advanced clock management, and multi‑gigabit transceiver options in the family documentation.
• Surface-mount BGA packaging 456-FBGA (23×23) supplier package provides a robust mounting and routing profile for production PCBs.
• Regulatory readiness RoHS compliance supports modern environmental requirements for electronic assemblies.

Why Choose XC2VP4-5FG456C?

The XC2VP4-5FG456C positions itself as a Virtex-II Pro platform FPGA suitable for designs that require a mix of programmable logic, embedded RAM, and substantial I/O in a compact BGA package. Its specification set — including approximately 6,768 logic elements, ~0.52 Mbits of on-chip RAM, 248 I/O, and the platform capabilities described in the Virtex-II Pro documentation — makes it a solid choice for commercial applications that need configurable hardware with integrated platform-level features.

Choose this device when your design benefits from platform-level FPGA resources, RoHS compliance, and the package and electrical characteristics specified (1.425 V–1.575 V core supply, 0 °C–85 °C operating range). It is well suited to teams leveraging the Virtex-II Pro family documentation for system-level planning and implementation.

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