XC2VP4-5FF672I

IC FPGA 348 I/O 672FCBGA
Part Description

Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 348 516096 6768 672-BBGA, FCBGA

Quantity 934 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O348Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs752Number of Logic Elements/Cells6768
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of XC2VP4-5FF672I – Virtex®-II Pro FPGA, 672-FCBGA (27×27)

The XC2VP4-5FF672I is a Virtex®-II Pro family FPGA offered in a 672-BBGA/672-FCBGA package. It provides a mid-range configurable logic resource set with on-chip embedded memory and extensive I/O capability for industrial applications.

Based on the Virtex‑II Pro platform, the product targets designs that require flexible logic, embedded memory, and a broad set of I/O—suitable for communications, embedded processing, and signal-processing use cases that leverage the series architecture.

Key Features

  • Configurable Logic Capacity – 752 CLBs and 6,768 logic elements offer programmable logic resources for custom digital designs.
  • Embedded Memory – Approximately 0.516 Mbits (516,096 bits) of on-chip RAM supports buffering, FIFOs, and local data storage.
  • I/O Resources – 348 user I/O pins provide broad external interface options for peripherals and high-density boards.
  • Power and Voltage – Operates from a core supply voltage range of 1.425 V to 1.575 V, enabling compatibility with standard FPGA power rails.
  • Package and Mounting – Supplied in a 672-FCBGA (27×27) flip-chip BGA package; surface-mount mounting for compact, high-density PCB designs.
  • Temperature and Grade – Industrial-grade device rated for operation from −40 °C to 100 °C.
  • Platform-Level Capabilities – The Virtex‑II Pro family includes features such as embedded processor blocks, RocketIO multi‑gigabit transceivers, dedicated 18‑bit×18‑bit multipliers, and clock-management circuitry; refer to family documentation for details applicable to specific device configurations.
  • Standards and Compliance – RoHS compliant.

Typical Applications

  • Communications and Networking – Use the platform’s high-density I/O and family-level transceiver capabilities for networking interfaces and data-path processing.
  • Embedded Processing – Leverage the Virtex‑II Pro platform’s embedded processor block options and programmable logic for control and protocol handling within complex systems.
  • Signal Processing – On-chip RAM and dedicated multiplier resources in the family support filtering, transforms, and other DSP tasks.
  • Industrial Control – Industrial temperature rating and abundant I/O make the device suitable for motor control, automation, and sensor aggregation systems.

Unique Advantages

  • Balanced Logic and Memory – 6,768 logic elements paired with approximately 0.516 Mbits of embedded RAM provide a practical balance for mid-range designs.
  • High I/O Density – 348 I/O pins simplify external connectivity and reduce the need for additional interface components.
  • Industrial Temperature Range – Rated −40 °C to 100 °C to support deployed systems operating across wide thermal environments.
  • Compact, High-Density Packaging – 672-FCBGA (27×27) package supports dense board layouts while maintaining robust electrical performance.
  • Platform-Level Integration Options – The Virtex‑II Pro family’s processor and transceiver features enable tighter integration of control, datapath, and I/O in a single device family.
  • Regulatory Compliance – RoHS compliance facilitates use in regulated supply chains.

Why Choose XC2VP4-5FF672I?

The XC2VP4-5FF672I positions itself as a mid-range Virtex‑II Pro platform FPGA that combines a practical mix of configurable logic, on-chip memory, and a high number of I/O pins in a 672‑ball FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for deployed embedded and communications systems that require reliable, long-lived hardware.

This device is well suited for engineering teams building solutions that need platform-level integration—such as embedded processing and high-density interfacing—while keeping board area and component count under control. Use this part when you need a Virtex‑II Pro family device with the listed logic, memory, I/O, and package characteristics.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability information for XC2VP4-5FF672I.

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