XC2VP30-7FFG1152C

The XC2VP30-7FFG1152C is a Virtex®-II Pro Field Programmable Gate Array (FPGA) IC from AMD, offered in a 1152-ball FCBGA package for surface-mount assembly. It delivers high logic density and extensive I/O to address embedded processing, high-density interfacing, and system integration workloads.

Built on the Virtex-II Pro platform family architecture, this device targets designs that require large programmable logic resources, substantial on-chip memory, and a compact package footprint for commercial-temperature applications.

Key Features

• Logic Capacity  30,816 logic elements provide substantial programmable logic for complex digital functions and custom processing pipelines.
• Embedded Memory  Approximately 2.5 Mbits of on-chip RAM (2,506,752 bits) for buffering, lookup tables, and data storage close to logic.
• High I/O Count  644 user I/O pins enable dense external interfacing and support for multiple parallel buses or mixed I/O domains.
• Compact Package  1152-FCBGA (35×35) package case in an FCBGA form factor, optimized for surface-mount PCB assembly and high pin-count routing.
• Supply Voltage  Core supply range 1.425 V to 1.575 V for defined power rail planning in system designs.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation suitable for commercial electronics and controlled-environment equipment.
• Surface Mount  Designed for surface-mount assembly methods commonly used in modern production lines.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.
• Virtex-II Pro Family Features (series-level)  The Virtex®-II Pro family includes platform capabilities such as embedded processor blocks and multi-gigabit transceiver support (family-level features described in the product series documentation).

Typical Applications

• Embedded Processing Platforms  Use the programmable logic and on-chip memory to implement custom accelerators, control logic, and protocol handling in embedded systems.
• High‑Density I/O Systems  Large 644-pin I/O count supports designs requiring multiple parallel interfaces, wide data buses, or mixed-signal front-ends.
• Telecom and Datacom Modules  The Virtex-II Pro series architecture is suited to applications that need platform FPGA flexibility for high-bandwidth serial or parallel interfaces (see family documentation for transceiver and processor block details).
• System Integration and Prototyping  High logic element count and embedded RAM make this device useful for consolidating multiple functions into a single FPGA during system-level prototyping and integration.

Unique Advantages

• High logic density: 30,816 logic elements enable implementation of complex state machines, datapaths, and custom compute blocks without external ASICs.
• Substantial on-chip RAM: Approximately 2.5 Mbits of embedded memory reduces reliance on external memory for buffering and LUT-based storage.
• Extensive external connectivity: 644 I/O pins simplify board-level routing for multi-channel systems and high-bandwidth interfaces.
• Space-efficient packaging: 1152-ball FCBGA (35×35) provides a dense pinout in a compact footprint for optimized PCB area usage.
• Predictable supply requirements: Defined core voltage range (1.425 V–1.575 V) facilitates power sequencing and regulator selection in system designs.
• RoHS-compliant and surface-mount ready: Meets environmental requirements and is compatible with standard SMT assembly processes.

Why Choose XC2VP30-7FFG1152C?

The XC2VP30-7FFG1152C positions itself as a flexible platform FPGA for commercial applications that demand a balance of high logic resources, on-chip memory, and a large number of I/O in a compact FCBGA package. Its specification set supports integration of complex digital functions and extensive interfacing while simplifying board-level design with a high pin-count BGA.

This device is well suited for engineering teams implementing embedded processing, high-density I/O subsystems, and system-level prototypes where predictable voltage and temperature requirements, along with RoHS compliance, are primary considerations.

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