XC2VP30-6FGG676C

The XC2VP30-6FGG676C is a Virtex®-II Pro series FPGA from AMD, designed for high-density programmable logic applications. It provides a combination of large logic capacity, substantial embedded RAM, and a high pin-count BGA package to address commercial designs that require extensive I/O, on-chip memory and flexible reconfigurable logic.

Key Features

• Logic Capacity — 30,816 logic elements and 3,424 configurable logic blocks (CLBs) for implementing complex digital functions and custom processing pipelines.
• Embedded Memory — Approximately 2.5 Mbits of on-chip RAM to support buffering, packet processing, and data-path implementations without external memory in many designs.
• I/O Density — 416 user I/O pins to support high-channel-count interfaces, parallel busses and mixed-signal front-ends.
• Package & Mounting — 676-ball Fine-pitch BGA (676-FBGA, 27×27) in a surface-mount package for compact, high-density board layouts.
• Supply Voltage — Core supply specified at 1.425 V to 1.575 V for predictable power planning and regulation design.
• Operating Range & Grade — Commercial grade operation from 0 °C to 85 °C, suitable for a wide range of commercial and enterprise applications.
• RoHS Compliant — Meets RoHS environmental requirements for restricted substances.

Typical Applications

• Telecommunications & Networking — High I/O count and on-chip RAM enable packet buffering, protocol bridging and interface aggregation in network equipment and distribution systems.
• Embedded Processing & Control — Large logic capacity supports custom processing engines, hardware accelerators and control logic for commercial embedded systems.
• Signal Processing & Data Acquisition — Substantial on-chip memory and abundant logic elements suit data-path processing, filtering and real-time analysis tasks.
• High-Density I/O Systems — 416 I/O pins and the 676-FBGA package make the device a fit for applications that require many parallel interfaces or channelized connectivity.

Unique Advantages

• High logic density: 30,816 logic elements provide the headroom for complex system-on-chip style implementations and multiple concurrent functions on a single device.
• Significant embedded memory: Approximately 2.5 Mbits of RAM reduces reliance on external memory, simplifying BOM and improving data-path latency.
• Extensive I/O capability: 416 user I/Os enable flexible board-level integration and support for many interface standards or multi-channel designs.
• Compact, production-ready package: 676-FBGA (27×27) with surface-mount mounting supports dense PCB routing while maintaining a manufacturable form factor.
• predictable power and thermal envelope: Defined core voltage range (1.425 V–1.575 V) and commercial operating temperature range (0 °C–85 °C) assist in system-level power and thermal design.
• Regulatory readiness: RoHS compliance supports environmental and regulatory requirements for commercial products.

Why Choose XC2VP30-6FGG676C?

The XC2VP30-6FGG676C delivers a balance of dense programmable logic, meaningful on-chip memory and a high I/O count in a compact BGA package—making it well suited for commercial embedded, networking and signal-processing applications that require flexibility and integration. Its clear power and temperature specifications streamline system integration and board-level design, while RoHS compliance aligns with contemporary manufacturing requirements.

This device is appropriate for design teams seeking a proven Virtex®-II Pro family FPGA platform with the capacity to consolidate multiple functions onto a single programmable device, reducing system complexity and board-level component count.

If you would like pricing, availability or to request a formal quote for XC2VP30-6FGG676C, submit an inquiry to receive a prompt response from our sales team.