XC2VP30-6FG676C

The XC2VP30-6FG676C is a Virtex-II Pro family Field Programmable Gate Array supplied in a 676-ball fine-pitch BGA (27 × 27 mm) package. This surface-mount, commercial-grade FPGA provides a balance of programmable logic, embedded memory, and I/O density for embedded processing and high-performance digital designs.

Targeted at applications that require sizable on-chip memory, abundant I/O, and programmable logic capacity, the device delivers a platform-level architecture suitable for designs leveraging embedded processors and multi-gigabit transceivers as described for the Virtex-II Pro family.

Key Features

• Logic Capacity  3,424 configurable logic blocks (CLBs) providing 30,816 logic elements (cells) to implement complex programmable logic and control functions.
• Embedded Memory  Approximately 2.5 Mbits of total on-chip RAM for buffering, FIFOs, and temporary data storage within user logic.
• I/O Density  Up to 416 user I/O pins to support parallel interfaces and board-level connectivity needs.
• Platform Architecture  Part of the Virtex-II Pro family, which includes architecture-level support for embedded processor blocks and RocketIO multi-gigabit transceivers as part of the series feature set.
• Package & Mounting  676-ball FBGA (27 × 27 mm) package, surface-mount mounting type for high-density board integration.
• Power Supply  Core voltage range specified at 1.425 V to 1.575 V for system power planning and regulator selection.
• Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to support assembled-board regulatory requirements.

Typical Applications

• Embedded Processing Platforms  Leverage the Virtex-II Pro family architecture for designs that integrate on-chip processor blocks alongside custom logic.
• High-Density I/O Systems  Use the 416 user I/O pins for routing multiple parallel interfaces, sensor arrays, or high-channel-count control systems.
• Data Buffering and Packet Processing  Approximately 2.5 Mbits of embedded RAM supports buffering, packet queues, and on-chip data manipulation in communications or networking modules.

Unique Advantages

• Substantial Logic Resources: 30,816 logic elements with 3,424 CLBs provide the programmable capacity required for mid-to-large scale FPGA designs without immediate need for external programmable logic.
• Generous On-Chip Memory: Approximately 2.5 Mbits of embedded RAM reduces dependence on external memory for many real-time buffering and data-path tasks.
• High I/O Count: 416 user I/O pins enable complex board-level interfacing for multi-channel, parallel, or mixed-signal front ends.
• Standard Commercial Temperature Range: Rated for 0 °C to 85 °C operation to meet industrial and commercial system requirements.
• Package for Dense Board Layouts: 676-FBGA (27 × 27 mm) supports compact, high-density PCB designs while remaining surface-mount compatible.
• Regulatory Friendly: RoHS compliance supports environmentally mandated manufacturing and supply chains.

Why Choose XC2VP30-6FG676C?

The XC2VP30-6FG676C positions itself as a commercial-grade, platform-oriented FPGA offering a combination of sizeable logic capacity, embedded memory, and high I/O count in a compact 676-ball FBGA package. Its core voltage window and operating temperature range make it straightforward to integrate into mid-volume embedded and communications products.

This device is appropriate for designers seeking a programmable platform with on-chip resources to implement embedded processing elements, data buffering, and multi-interface connectivity while relying on a well-documented family architecture and predictable electrical and thermal parameters.

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