XC2VP30-6FFG896C

The XC2VP30-6FFG896C is a Virtex®-II Pro field programmable gate array (FPGA) in a 896-ball FCBGA package (31 × 31). This commercial-grade, surface-mount device delivers a high-density programmable fabric with 30,816 logic cells and approximately 2.5 Mbits of embedded RAM for custom digital logic, memory buffering, and on-chip data processing.

With 556 user I/Os, a defined 1.425 V to 1.575 V core supply range and a 0 °C to 85 °C operating temperature window, this device is intended for applications that require significant logic capacity, on-chip RAM, and extensive I/O connectivity while conforming to RoHS requirements.

Key Features

• Logic Capacity — 30,816 logic cells suitable for sizeable programmable designs and complex custom logic implementations.
• Embedded Memory — Approximately 2.5 Mbits of on-chip RAM for high-bandwidth buffering, lookup tables, and state storage.
• High I/O Count — 556 user I/Os to support dense external interfacing and multi-channel connectivity.
• Package and Mounting — 896-ball FCBGA (31 × 31) package, surface-mount for board-level integration where BGA packaging is required.
• Powering — Core voltage supply specified between 1.425 V and 1.575 V to match target system power rails.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Family-Level Capabilities — As part of the Virtex-II Pro family, the device line supports features such as embedded multi-gigabit transceivers (RocketIO/RocketIO X), optional embedded PowerPC™ processor blocks, dedicated 18-bit × 18-bit multiplier blocks, digitally controlled impedance (DCI) I/O, and clock management resources.
• Regulatory — RoHS-compliant product.

Typical Applications

• High-density logic implementations — Use the large logic cell count and embedded RAM for custom accelerators, protocol processing, and state-heavy designs.
• I/O-intensive systems — Leverage 556 user I/Os for multi-channel interfaces, bridging between diverse peripherals, or dense front-end connectivity.
• Embedded processing platforms — As a member of the Virtex-II Pro family, suitable for designs that combine programmable logic with the family’s processor-block options for embedded control and offload tasks.
• High-speed serial and communications — Family-level RocketIO/RocketIO X transceiver support addresses high-bandwidth serial links and telecom/datacom protocols where multi-gigabit transceivers are used.

Unique Advantages

• Substantial on-chip resources: 30,816 logic cells plus approximately 2.5 Mbits of embedded RAM reduce external memory dependence and accelerate data-path designs.
• Extensive I/O reach: 556 user I/Os simplify board routing for multi-interface applications and lower the need for external I/O expanders.
• Board-level integration: 896-ball FCBGA packaging supports compact, high-density PCB layouts for space-constrained systems.
• Family ecosystem: Virtex-II Pro family features—such as embedded multipliers, clock management, and optional processor/transceiver blocks—provide design scalability and access to established IP and reference materials.
• Commercial-grade reliability: Specified operating temperature and supply ranges align with standard commercial embedded and communications equipment requirements.
• Standards-conscious manufacturing: RoHS compliance supports environmentally conscious product development and regulatory alignment.

Why Choose XC2VP30-6FFG896C?

The XC2VP30-6FFG896C positions itself as a high-density, I/O-rich FPGA solution for commercial embedded systems that need substantial logic resources and on-chip memory in a BGA footprint. Its combination of 30,816 logic cells, approximately 2.5 Mbits of embedded RAM, and 556 I/Os makes it suitable for complex protocol processing, data-path acceleration, and multi-interface designs.

As part of the Virtex-II Pro family, this device benefits from a mature ecosystem of documentation and family-level capabilities—such as multi-gigabit transceivers and embedded processor block options—providing designers with pathways to scale performance and integrate advanced functions while maintaining predictable power and thermal behavior within the specified commercial ranges.

Request a quote or submit an inquiry for pricing and availability for the XC2VP30-6FFG896C to evaluate this device for your next design.