XC2VP30-6FF896C

The XC2VP30-6FF896C is a Virtex®-II Pro series FPGA in an 896-ball FCBGA (31×31) surface-mount package. It provides a platform-class architecture with embedded processing and high-density programmable logic for systems requiring significant logic capacity, on-chip memory, and large I/O counts.

Designed for commercial-grade applications, this device combines approximately 30,816 logic elements with roughly 2.5 Mbits of embedded RAM and 556 user I/O pins, operating from a 1.425 V to 1.575 V core supply and rated for 0 °C to 85 °C. The Virtex-II Pro family architecture includes features such as embedded processor blocks and RocketIO multi-gigabit transceivers, along with established FPGA building blocks for signal and clock management.

Key Features

• Logic Capacity  Approximately 30,816 logic elements to implement complex control, datapath, and protocol logic.
• Embedded Memory  Approximately 2.5 Mbits of on-chip RAM (2,506,752 bits) for buffering, FIFOs, and state storage.
• High I/O Density  556 user I/O pins to support dense external interfacing and board-level connectivity.
• Package and Mounting  896-ball FCBGA package (31×31) in a surface-mount form factor for compact, high-pin-count board implementations.
• Power and Temperature  Core voltage range 1.425 V to 1.575 V; commercial operating temperature range 0 °C to 85 °C.
• Virtex-II Pro Platform Features  Family-level capabilities include embedded PowerPC™ 405 processor blocks, RocketIO™ multi-gigabit transceivers, dedicated 18×18 multipliers, SelectRAM™+ memory hierarchy, and digital clock management (as described in the Virtex-II Pro data specification).
• RoHS Compliant  Conforms to RoHS requirements for environmentally compliant assembly.

Typical Applications

• Embedded Processing and Control  Use the Virtex-II Pro platform capabilities for integrated control tasks and on-chip processor acceleration in compact systems.
• Telecom and Datacom Interfaces  Leverage the family’s RocketIO transceiver architecture and large I/O count for high-speed serial and parallel interface implementations.
• Signal Processing and DSP  Implement filters, accelerators, and datapath logic using the device’s logic density, embedded RAM, and dedicated multiplier resources.
• High-Density I/O Systems  Ideal for applications that require many external signals and routing options within a single FPGA package.

Unique Advantages

• Substantial Logic and Memory in One Device: Approximately 30,816 logic elements plus ~2.5 Mbits of embedded RAM enable consolidation of multiple functions on a single FPGA.
• Large, Flexible I/O Count: 556 user I/Os in an 896-FCBGA simplify board-level routing and reduce the need for external I/O expanders.
• Platform-Level Integration: Virtex-II Pro family features such as embedded processor blocks and RocketIO transceivers support mixed compute and high-speed interface requirements.
• Commercial-Grade Thermal Range: Rated for 0 °C to 85 °C operation to suit a broad set of commercial applications and environments.
• RoHS Compliance: Environmentally compliant assembly for markets requiring lead-free components.

Why Choose XC2VP30-6FF896C?

The XC2VP30-6FF896C delivers a balanced combination of logic density, embedded memory, and high I/O count within a compact 896-FCBGA package. It is well suited to designers who need to integrate substantial programmable logic, on-chip RAM, and comprehensive I/O in commercial-grade systems. Backed by the Virtex-II Pro platform capabilities and supporting documentation for processor and transceiver features, this device supports complex embedded, datacom, and signal-processing designs.

Request a quote or submit a purchase inquiry for the XC2VP30-6FF896C to obtain pricing and availability information and begin specifying this device into your next design.