XC2VP30-6FF1152I

The XC2VP30-6FF1152I is a Virtex®-II Pro platform Field Programmable Gate Array (FPGA) in a 1152-ball FCBGA package targeted at industrial applications. It combines programmable logic, embedded memory, a high I/O count and support for on-chip processor and high-speed serial blocks as described in the Virtex-II Pro family specification.

This device is suited for designs requiring substantial programmable logic capacity, significant embedded memory, and a large number of I/O channels within a surface-mount FCBGA package and an industrial operating temperature range.

Key Features

• Logic Capacity — 30,816 logic elements (cells) providing a substantial programmable fabric for custom logic implementations.
• Embedded Memory — Approximately 2.5 Mbits of on-chip RAM (2,506,752 bits) for data buffering, packet storage and temporary working memory.
• I/O Resources — 644 user I/O pins to support wide parallel interfaces and complex board-level connectivity.
• High-Speed Serial & Embedded Processors — Virtex-II Pro family features include RocketIO multi-gigabit transceivers (family supports up to twenty) and up to two IBM PowerPC processor blocks for embedded processing and serial communications support.
• DSP Support — Dedicated 18-bit × 18-bit multiplier blocks and SelectRAM memory hierarchy described in the family datasheet for arithmetic and signal processing functions.
• Package & Mounting — 1152-ball FCBGA package (1152-FCBGA, 35 × 35 mm) designed for surface-mount assembly.
• Power & Voltage — Core supply range 1.425 V to 1.575 V, enabling precise power design and regulation.
• Operating Range — Industrial temperature grade with an operating range of −40 °C to +100 °C.
• Compliance — RoHS compliant, meeting common lead-free manufacturing requirements.

Typical Applications

• Telecom / Datacom Systems — High-speed serial transceiver capability and programmable fabric support protocol handling, packet processing and serial aggregation functions.
• Embedded Processing and Control — On-chip PowerPC processor blocks (family feature) combined with FPGA logic allow integration of control software and custom hardware acceleration on the same device.
• Signal Processing and DSP — Dedicated multiplier blocks and embedded RAM support filtering, transform and real-time data processing tasks.
• High-Density I/O Systems — 644 I/O pins and the 1152-FCBGA package enable designs requiring extensive board-level connectivity and parallel interfaces.

Unique Advantages

• Highly integrated programmable platform: Combines tens of thousands of logic elements, embedded memory and dedicated DSP resources for consolidated system designs.
• Embedded processing capability: Family support for PowerPC cores enables software-driven control and coordination alongside custom hardware logic.
• High I/O density: 644 user I/Os allow broad connectivity options without external multiplexing.
• Industrial reliability: Specified for −40 °C to +100 °C operation and supplied in a robust 1152-ball FCBGA for industrial applications.
• Designed for high-speed communications: RocketIO transceivers in the Virtex-II Pro family and on-chip clock management features support telecom/datacom interfaces.
• RoHS compliant: Meets lead-free manufacturing requirements for modern production flows.

Why Choose XC2VP30-6FF1152I?

The XC2VP30-6FF1152I delivers a balanced combination of programmable logic density, embedded memory and extensive I/O in an industrial-grade FCBGA package. It is well suited for designers who need integrated processor capability, high-speed serial support and significant on-chip resources for complex, space-constrained systems.

Choosing this Virtex®-II Pro device offers a scalable platform for applications that require a mix of algorithm acceleration, protocol handling and I/O-rich interfaces, all while conforming to RoHS and industrial temperature requirements.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the XC2VP30-6FF1152I.