XC2VP30-5FG676I

The XC2VP30-5FG676I is a Virtex®-II Pro platform FPGA offering a high-density, industrial-grade programmable logic solution. Built on the Virtex-II Pro architecture, the device targets applications that require substantial logic capacity, abundant I/O, and on-chip memory for complex system functions.

Typical market segments include communications, industrial control, and embedded processing platforms where integration of logic, memory, and high-performance I/O helps reduce system complexity and BOM. The device pairs significant logic resources and embedded memory with a 676-ball FBGA package for space-efficient board integration.

Key Features

• Logic Capacity — 30,816 logic elements (cells) to implement complex digital logic and custom processing pipelines.
• On‑chip Memory — Approximately 2.5 Mbits of embedded memory (2,506,752 bits) for buffering, lookup tables, and local storage.
• I/O Count — 416 user I/O pins, enabling broad peripheral and bus connectivity on a single device.
• Package — 676-FBGA (27 × 27 mm) supplier device package in a 676‑BGA case for high-density PCB layouts.
• Power Supply — Core voltage range specified at 1.425 V to 1.575 V to match platform power rails.
• Operating Range — Industrial temperature rating from −40 °C to 100 °C for deployment in demanding thermal environments.
• Platform Capabilities — Virtex‑II Pro family features include embedded multi‑gigabit transceiver options (RocketIO / RocketIO X) and integrated PowerPC processor blocks as available on platform devices, supporting system-level integration of serial links and embedded processing.
• Mounting — Surface-mount device to support automated PCB assembly processes.
• RoHS Compliant — Meets RoHS requirements for lead-free assembly and supply-chain compliance.

Typical Applications

• High‑performance Communications — Implements protocol handling, packet processing, and interface bridging using the device’s large logic array and plentiful I/O.
• Industrial Control Systems — Provides deterministic control logic and local buffering with industrial temperature support for factory automation and motion control.
• Embedded Processing Platforms — Integrates custom accelerators and memory buffers alongside platform processor blocks for system-level offload and real-time processing.
• Custom Networking Equipment — Enables implementation of data plane functions, switching logic, and peripheral interfaces within a single FPGA package.

Unique Advantages

• High Logic Density: 30,816 logic elements enable substantial on-chip implementation of complex algorithms and state machines, reducing external ASIC/FPGA counts.
• Significant Embedded Memory: Approximately 2.5 Mbits of RAM supports large buffering and look‑up structures for high-throughput designs.
• Broad I/O Availability: 416 user I/O pins allow direct interfacing to a wide range of external components and buses without multiplexing compromises.
• Industrial‑Grade Thermal Range: −40 °C to 100 °C operation supports robust performance in harsh or temperature-variable environments.
• Dense, Board‑Friendly Package: 676-FBGA (27×27 mm) package facilitates high-density PCB layouts while keeping the solution compact.
• Platform Integration: Virtex‑II Pro family capabilities such as embedded transceivers and processor blocks enable system consolidation where serial links and embedded processing are required.

Why Choose XC2VP30-5FG676I?

The XC2VP30-5FG676I combines substantial logic resources, meaningful on‑chip memory, and a large I/O complement in an industrial‑rated package—making it suited for designs that demand integration, scalability, and reliable operation across a wide temperature range. Its Virtex‑II Pro platform heritage provides architectural features that support high-performance serial interfaces and embedded processing when those platform capabilities are required.

This device is appropriate for engineering teams building communications, industrial control, or embedded systems that need a dense, flexible FPGA solution with clear electrical and mechanical specifications for integration into production hardware.

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