XC2VP30-5FFG1152I

The XC2VP30-5FFG1152I is a Virtex®-II Pro field programmable gate array (FPGA) IC provided in a 1152-ball flip-chip BGA (35×35 mm) package. Built on the Virtex-II Pro platform technology, this device targets industrial applications that require significant logic capacity, abundant I/O, and programmable on-chip memory and DSP resources.

Key value comes from a combination of approximately 30,816 logic elements, roughly 2.5 Mbits of embedded memory, and a large I/O count—making it suitable for complex embedded processing, high-density interfacing, and communications-oriented designs that operate across a wide industrial temperature range.

Key Features

• Logic Capacity — Approximately 30,816 logic elements with 3,424 logic blocks, enabling complex programmable logic implementations.
• Embedded Memory — Approximately 2.5 Mbits of on-chip RAM for buffering, packet storage, and embedded data structures.
• High I/O Count — 644 user I/O pins to support wide data buses, parallel interfaces, and dense board-level connectivity.
• Virtex-II Pro Platform Features — Family-level features include support for RocketIO/RocketIO X multi-gigabit transceivers, up to two IBM PowerPC RISC processor blocks, dedicated 18×18 multiplier blocks, digital clock management (DCM), and SelectRAM™+ memory hierarchy.
• Package and Mounting — 1152-ball FCBGA (35×35 mm) package designed for surface-mount assembly.
• Voltage and Temperature — Core voltage 1.425 V to 1.575 V and industrial operating temperature range from −40 °C to 100 °C.
• Standards and Compliance — RoHS compliant.

Typical Applications

• Telecommunications & Networking — Use the device’s high I/O density and family-level RocketIO transceiver support to implement packet processing, line cards, and protocol bridging.
• Embedded Processing — Leverage on-chip memory and the Virtex-II Pro platform’s processor-block capability for control-plane functions and system management.
• Signal Processing & DSP — Dedicated multiplier blocks and abundant logic resources suit custom DSP pipelines, filtering, and real-time data manipulation.
• Industrial Control & Automation — Industrial temperature grade and wide I/O make the FPGA suitable for motor control, machine vision interfacing, and factory automation logic.

Unique Advantages

• Substantial Logic and Memory Density: 30,816 logic elements and ~2.5 Mbits of embedded RAM provide headroom for complex system functions without external memory for many tasks.
• Large I/O Footprint: 644 I/Os allow direct interfacing to wide buses, multiple peripherals, or parallel sensors, reducing the need for external multiplexing.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in demanding environments where extended thermal tolerance is required.
• Platform-Level Integration: Built on the Virtex-II Pro platform with on-chip DSP multipliers, clock management, and processor-block support for integrated system-level designs.
• RoHS Compliant: Meets environmental regulatory requirements for lead-free assembly and materials handling.
• Robust Package: 1152-ball FCBGA package provides a high-density, board-friendly form factor for space-constrained designs.

Why Choose XC2VP30-5FFG1152I?

The XC2VP30-5FFG1152I positions itself as a high-capacity, industrial-temperature FPGA option within the Virtex-II Pro family. Its combination of tens of thousands of logic elements, megabits of embedded memory, and hundreds of I/Os lets engineers consolidate functions that would otherwise require multiple devices, simplifying board layout and BOM.

This device is well suited to engineering teams designing communications equipment, embedded controllers with heavy logic needs, and industrial systems that require durable components and extensive interfacing. Choosing this FPGA can deliver scalable, programmable hardware resources backed by the Virtex-II Pro platform capabilities.

Request a quote today to discuss availability and pricing for XC2VP30-5FFG1152I or to submit a procurement inquiry.