XC2VP30-5FF896C
| Part Description |
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 556 2506752 30816 896-BBGA, FCBGA |
|---|---|
| Quantity | 790 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FCBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 556 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 3424 | Number of Logic Elements/Cells | 30816 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2506752 |
Overview of XC2VP30-5FF896C – Virtex®-II Pro FPGA (896-FCBGA)
The XC2VP30-5FF896C is a Virtex®-II Pro series Field Programmable Gate Array (FPGA) in a 896-ball flip-chip FCBGA package, offered as a surface-mount commercial-grade device. It delivers substantial on-chip resources for embedded logic, memory and high-density I/O, making it suitable for complex digital, signal-processing and embedded compute applications.
Built on the Virtex-II Pro platform, the family includes platform-level capabilities such as embedded processor blocks and multi-gigabit transceiver support, enabling integration of processing, high-speed serial connectivity and programmable logic within a single device footprint.
Key Features
- Logic Capacity — Approximately 30,816 logic elements (cells) for implementing complex combinational and sequential logic.
- Embedded Memory — Approximately 2.5 Mbits of on-chip RAM (2,506,752 bits) to support buffering, FIFOs and embedded data structures.
- High-Density I/O — Up to 556 user I/O pins to interface with peripherals, parallel buses and board-level signals.
- Platform-Level Processor and Transceiver Support — Virtex-II Pro platform features include support for embedded PowerPC™ RISC processor blocks and RocketIO™ multi-gigabit transceivers (family-level capabilities described in the Virtex-II Pro datasheet).
- DSP and Clock Management — Platform architecture provides dedicated multiplier blocks and high-performance clock management circuitry (family-level features listed in the Virtex-II Pro documentation).
- Package and Mounting — 896-FCBGA package (31 × 31) in surface-mount form factor for dense board integration.
- Voltage and Thermal — Core supply range 1.425 V to 1.575 V; commercial operating temperature range 0 °C to 85 °C.
- Compliance — RoHS-compliant manufacturing.
Typical Applications
- High-performance networking: Use the device’s large logic capacity and platform transceiver support for packet processing, protocol bridging and line-card functions.
- Embedded compute and control: Leverage the Virtex-II Pro platform’s embedded processor support and programmable logic for system controllers and complex control algorithms.
- Signal processing and instrumentation: Utilize the device’s on-chip RAM and multiplier resources for data streaming, filtering and real-time signal processing tasks.
- System integration and prototyping: Combine extensive I/O and dense logic resources to integrate multiple board-level functions into a single FPGA for prototype and system validation work.
Unique Advantages
- Substantial on-chip resources: Large logic element count and roughly 2.5 Mbits of embedded RAM reduce the need for external memory and simplify system architecture.
- Extensive I/O connectivity: 556 I/O pins support broad peripheral interfacing and multi-channel designs without immediate need for expansion devices.
- Platform extensibility: Virtex-II Pro family features such as embedded processor blocks and multi-gigabit transceiver support enable tightly integrated processing and high-speed serial links at the device level.
- Compact, board-friendly package: 896-FCBGA (31×31) offers a high-density implementation in a surface-mount form factor suitable for space-constrained designs.
- Commercial-grade reliability: Specified for 0 °C to 85 °C operation and RoHS-compliant production for standard commercial deployments.
Why Choose XC2VP30-5FF896C?
The XC2VP30-5FF896C packages the Virtex-II Pro platform’s programmable logic, substantial embedded memory and extensive I/O into a compact 896-ball FCBGA. It is well suited to engineers who need a programmable, integrated solution for applications that combine logic-intensive functions, embedded processing and dense connectivity in a commercial-temperature environment.
For designs that require on-chip memory, a high logic element count and broad I/O capacity—backed by the Virtex-II Pro platform architecture—this device offers a clear pathway to consolidate functions and reduce external component count while maintaining design flexibility.
Request a quote or submit an inquiry to purchase the XC2VP30-5FF896C and evaluate how its resources align with your next FPGA-based design.

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