XC2VP30-5FF1152C

The XC2VP30-5FF1152C is a Virtex®-II Pro platform FPGA offered in a 1152-ball flip-chip BGA package. Built on the Virtex-II Pro architecture, the device combines high logic capacity, substantial embedded RAM, a large I/O count and platform-level features documented for the Virtex-II Pro family such as integrated processor blocks and multi-gigabit transceiver support.

Designed for applications that require integrated processing and high-density logic, this commercial-grade FPGA is targeted at systems requiring extensive logic resources, abundant I/O, and on-chip memory while operating within standard commercial temperature and power envelopes.

Key Features

• Logic Capacity  30,816 logic elements provide a substantial resource pool for complex logic, state machines and glue-logic integration.
• Configurable Logic Blocks  Device-level CLB resources support a flexible, SRAM-based FPGA fabric suitable for custom digital designs.
• Embedded Memory  Approximately 2.5 Mbits of on-chip RAM (2,506,752 bits) for data buffering, FIFOs and lookup tables.
• I/O Density  644 user I/O pins offer broad external connectivity for parallel interfaces, control signals and board-level routing.
• High-Speed Communications (Family Feature)  Virtex-II Pro family documentation includes RocketIO multi-gigabit transceiver support and telecom/datacom modes; consult family datasheet for device-dependent transceiver availability and configurations.
• Embedded Processor Support (Family Feature)  Family-level architecture includes options for integrated IBM PowerPC processor blocks for on-chip embedded processing; refer to the full datasheet for implementation details.
• Package & Mounting  1152-ball FCBGA (35×35) package, surface-mount construction for high-density board designs.
• Power & Temperature  Specified supply range 1.425 V to 1.575 V with commercial operating temperature 0 °C to 85 °C.
• Compliance  RoHS-compliant device.

Typical Applications

• Telecom & Datacom Systems  Leverages the family’s multi-gigabit transceiver support and high I/O count for high-speed serial links and protocol handling (device-dependent transceiver availability).
• Embedded Processing Platforms  On-chip processor block support at the family level enables integration of control software and hardware acceleration within a single FPGA fabric.
• High-Density Logic Integration  Large logic element and RAM resources make the device suitable for complex glue logic, custom peripherals and programmable interfaces.
• Prototyping & System Integration  Surface-mount FCBGA packaging and abundant I/O support board-level integration and prototype-to-product workflows in commercial designs.

Unique Advantages

• Substantial On-Chip Logic: 30,816 logic elements enable consolidation of multiple digital functions into a single FPGA, reducing external component count.
• Significant Embedded Memory: Approximately 2.5 Mbits of RAM support frame buffering, packet queues and lookup structures without external SRAM.
• High I/O Count: 644 user I/O pins provide flexible interface options for parallel buses, control signals and mixed-signal front-end connections.
• Platform-Level Features: Virtex-II Pro family capability for embedded processor blocks and RocketIO transceivers allows designers to combine processing, logic and high-speed serial I/O (see datasheet for device-specific availability).
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match standard commercial applications and environments.
• RoHS Compliant: Meets environmental compliance requirements for lead-free assembly processes.

Why Choose XC2VP30-5FF1152C?

The XC2VP30-5FF1152C positions itself as a high-capacity, commercially graded Virtex-II Pro FPGA option for designs that require a balance of logic density, on-chip memory and extensive I/O. Its family-level platform features—such as embedded processor block support and multi-gigabit transceiver capability—allow system designers to architect integrated solutions that combine processing, custom logic and high-speed communication links.

This device is suited to engineers and procurement teams implementing complex digital systems, communications endpoints, or embedded platforms where consolidating functionality onto a single, programmable device streamlines board design and shortens development cycles. The combination of logic, RAM and I/O resources delivers scalable, long-lived value within commercial product roadmaps.

Request a quote or submit an inquiry to obtain pricing, lead time and availability for the XC2VP30-5FF1152C. Technical documentation and the complete family datasheet are available to assist evaluation and integration planning.