XC2VP30-5FFG1152C

The XC2VP30-5FFG1152C is a Virtex®-II Pro field programmable gate array (FPGA) in a 1152-ball FCBGA package, designed as a platform FPGA solution with integrated system-level resources. It provides a high I/O count and substantial embedded memory and logic capacity for applications that require dense, reconfigurable logic, on-chip RAM, and platform-level integration.

This commercial-grade device targets telecom/datacom and embedded processing markets where in-system configurability, abundant I/O, and processor/transceiver integration are valuable. Family-level architecture includes embedded processor blocks and RocketIO multi-gigabit transceiver capabilities for advanced system integration.

Key Features

• Logic Resources  Approximately 30,816 logic elements to implement complex glue logic, control, and custom processing functions.
• Embedded Memory  Approximately 2.5 Mbits of on-chip RAM (total RAM bits: 2,506,752) for buffering, packet storage, and local data handling.
• I/O Capacity  Up to 644 user I/O pins, enabling extensive parallel interfaces and high-density board-level connectivity.
• Processor & Transceiver Integration (Family Features)  Virtex-II Pro family devices can include up to two IBM PowerPC RISC processor blocks and up to twenty RocketIO or RocketIO X embedded multi-gigabit transceivers for embedded processing and high-speed serial connectivity (family-level capability specified in the product datasheet).
• Dedicated DSP Primitives (Family Features)  Dedicated 18-bit × 18-bit multiplier blocks and 18-Kb block SelectRAM resources are part of the Virtex-II Pro family architecture for efficient arithmetic and memory-intensive functions.
• Package & Mounting  1152-ball FCBGA package (1152-FCBGA, 35×35) in a surface-mount form factor to support compact, high-density board designs.
• Supply & Temperature  Operating voltage range 1.425 V to 1.575 V and commercial temperature range 0 °C to 85 °C, suitable for standard commercial embedded systems.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

• Telecom / Datacom Systems  Use the device’s family-level RocketIO transceiver capabilities and high I/O count for packet processing, framer/deframer logic, and interface bridging in communications equipment.
• Embedded Processing Platforms  Leverage the Virtex-II Pro family’s integrated PowerPC processor blocks and abundant logic/memory resources for control plane or application-specific acceleration tasks.
• High-Density Interface Aggregation  Deploy the 644 I/O pins and extensive logic fabric to consolidate multiple parallel interfaces and protocol translators on a single FPGA.
• Custom DSP and Acceleration  Apply the device’s dedicated multiplier blocks and block RAM resources to implement fixed-point DSP pipelines, filters, and hardware accelerators.

Unique Advantages

• Platform-Level Integration: Embedded processor block and RocketIO transceiver support at the family level reduce external component count and simplify system architecture.
• High I/O Density: 644 I/Os enable direct connections to multiple peripherals and parallel buses without extensive glue logic.
• Substantial On-Chip Memory: Approximately 2.5 Mbits of embedded RAM provide local buffering and state storage for latency-sensitive designs.
• Compact FCBGA Package: 1152-ball FCBGA (35×35) supports high pin count in a compact footprint for space-constrained boards.
• Commercial-Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance to align with commercial product requirements and environmental regulations.

Why Choose XC2VP30-5FFG1152C?

The XC2VP30-5FFG1152C combines a large logic element count, multi-megabit embedded RAM, and a very high I/O count in a compact FCBGA package, making it suitable for commercial embedded systems that require dense, reconfigurable logic and extensive board-level connectivity. Family-level features described in the product datasheet—such as integrated PowerPC processor blocks and RocketIO transceivers—support advanced system integration and reduce external component needs.

This device is a strong option for engineers designing telecom/datacom equipment, embedded processing platforms, or high-density interface aggregation solutions where platform-level FPGA capabilities and on-chip resources translate directly to reduced BOM complexity and faster time to market.

Request a quote or submit a sales inquiry to learn more about availability, pricing, and lead times for the XC2VP30-5FFG1152C. Our team can provide procurement details and help assess suitability for your design.