XC2VP30-5FG676C

The XC2VP30-5FG676C is a Virtex®-II Pro FPGA IC from AMD, delivered in a 676-ball fine-pitch BGA (27 × 27 mm) package for surface-mount assembly. It provides high logic density and extensive I/O in a commercial-grade FPGA intended for embedded and high-density logic applications.

With roughly 30,816 logic elements and approximately 2.5 Mbits of embedded RAM, this device targets designs that require substantial on-chip memory, flexible logic resources, and large I/O counts while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity  Approximately 30.8k logic elements (30,816 logic cells) to implement complex digital functions and control logic.
• Embedded Memory  Approximately 2.5 Mbits of on-chip RAM for buffering, state storage, and algorithmic working memory.
• I/O Density  416 user I/Os to support multiple interfaces, parallel buses, and wide data paths at the board level.
• Power and Supply  Core supply range 1.425 V to 1.575 V for the FPGA core power domain.
• Package & Mounting  676-FBGA (27 × 27 mm) package case in a surface-mount format for compact, high-density board designs.
• Operating Conditions  Commercial grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS compliant for environmental and regulatory alignment.
• Virtex-II Pro Family Capabilities  The Virtex-II Pro family datasheet documents platform-level features such as embedded PowerPC processor blocks and RocketIO multi-gigabit transceivers, along with dedicated 18 × 18 multiplier blocks and advanced clock management—refer to the datasheet for device-specific availability and configuration options.

Typical Applications

• High-performance communications  Used where dense logic and large I/O counts are needed to implement protocol bridging, packet processing, or interface aggregation—family transceiver and platform features support telecom/datacom designs (see datasheet for device-level options).
• Embedded processing  Suitable for systems that combine custom logic with embedded processors or soft cores, leveraging on-chip memory and logic capacity for control and data-path tasks.
• DSP and acceleration  On-chip RAM and dedicated multiplier resources make the device appropriate for signal processing, filtering, and hardware-accelerated computation blocks.
• Custom I/O and interface bridging  Large 416-pin I/O availability supports multiple parallel interfaces, sensor arrays, or wide data buses for board-level integration.

Unique Advantages

• High logic density:  About 30,816 logic elements enable implementation of complex state machines, datapaths, and glue logic in a single device.
• Substantial on-chip memory:  Approximately 2.5 Mbits of embedded RAM reduces external memory dependence and simplifies data buffering and packet handling.
• Extensive I/O count:  416 I/Os provide flexibility for multi-interface designs and dense board-level connectivity.
• Compact BGA packaging:  676-FBGA (27 × 27 mm) supports high-density PCB layouts while maintaining a surface-mount footprint.
• Commercial-grade reliability:  Specified for 0 °C to 85 °C operation and RoHS compliance, suitable for a wide range of commercial embedded products.
• Platform heritage:  Based on the Virtex-II Pro family platform; consult the datasheet for family-level capabilities such as embedded processor blocks and multi-gigabit transceiver options.

Why Choose XC2VP30-5FG676C?

The XC2VP30-5FG676C balances high logic capacity, meaningful embedded memory, and a large I/O complement in a compact 676-FBGA package, making it a strong choice for commercial embedded designs that demand on-chip resources and flexible interfacing. Its Virtex-II Pro platform lineage provides documented capabilities—such as dedicated multipliers, clock management, and optional processor/transceiver blocks—backed by an established datasheet and design guidance.

This device is well suited to teams implementing systems that require significant on-chip logic and memory while retaining flexibility for interface-rich board designs. The combination of density, package footprint, and RoHS compliance supports robust, scalable deployments in commercial products.

Request a quote or submit a quote today to evaluate the XC2VP30-5FG676C for your next high-density embedded FPGA design.