XC2VP30-5FGG676I

The XC2VP30-5FGG676I is a Virtex®-II Pro field-programmable gate array (FPGA) from AMD, built on the Virtex-II Pro platform architecture. It combines dense programmable logic, substantial embedded memory, plentiful I/O and platform-level features—making it suitable for industrial embedded systems, telecom/datacom designs, and high-density processing applications.

This device delivers a balance of logic resources, on-chip memory and platform-level IP such as multi-gigabit transceivers and processor integration described for the Virtex-II Pro family, while supporting an industrial operating temperature range and RoHS compliance.

Key Features

• Core Logic Resources — 3,424 CLBs providing 30,816 logic cells for implementing complex programmable logic and custom processing pipelines.
• Embedded Memory — Approximately 2.5 Mbits of on-chip RAM (2,506,752 total RAM bits) for packet buffering, lookup tables and local data storage.
• I/O and Package — Up to 416 I/O pins in a 676-BGA (27 × 27) fine-pitch ball-grid array; surface-mount package suitable for compact board designs.
• Processor and High-Speed I/O (Platform Features) — Virtex-II Pro family devices support embedded processor blocks (up to two IBM PowerPC cores) and RocketIO multi-gigabit transceivers (family support up to twenty), enabling integrated protocol handling and high-speed serial links.
• DSP and Clock Management — Dedicated 18-bit × 18-bit multiplier blocks and digital clock management (DCM) circuitry, useful for on-chip signal processing and clock control.
• Power and Thermal — Core supply range 1.425 V to 1.575 V and industrial operating temperature range from −40°C to 100°C for extended-environment deployments.
• Manufacturing and Compliance — Surface-mount 676-FBGA package (27 × 27) and RoHS-compliant construction.

Typical Applications

• Telecom & Datacom — Leverages family-level RocketIO transceiver capability and high I/O density for board-level network interfaces, line cards and serial link aggregation.
• Embedded Processing — On-chip processor block support and abundant logic/memory resources enable offloading control and protocol tasks from host processors.
• Industrial Control & Instrumentation — Industrial-grade temperature range and rugged package make the device suitable for automation, machine control and data-acquisition systems.
• High-Density Prototyping & OEM Systems — Large CLB and logic-cell count with significant embedded RAM supports complex, space-constrained designs and OEM product development.

Unique Advantages

• Highly integrated platform — Platform-level features from the Virtex-II Pro family (embedded processors and multi-gigabit transceivers) reduce external components and simplify system architecture.
• Substantial logic and memory capacity — 3,424 CLBs and roughly 2.5 Mbits of embedded RAM accommodate complex logic functions and local data buffering on-chip.
• High I/O density in a compact footprint — 416 I/Os in a 676-BGA (27 × 27) package supports rich external connectivity while conserving board area.
• Industrial-grade operating range — −40°C to 100°C rating aligns with demanding environmental requirements for field-deployed equipment.
• Design-ready power window — Core supply specified from 1.425 V to 1.575 V for predictable power planning and thermal design.
• Standards-conscious manufacturing — RoHS compliance supports regulatory and environmental requirements.

Why Choose XC2VP30-5FGG676I?

The XC2VP30-5FGG676I positions itself as a high-density Virtex-II Pro device for engineers needing a mix of programmable logic, significant on-chip RAM and platform-level capabilities such as embedded processor support and multi-gigabit transceivers. Its industrial temperature rating, defined core supply window and RoHS compliance make it a practical choice for production systems in communications, industrial automation and embedded OEM applications.

Designed for teams that require a compact BGA package with extensive I/O and strong on-chip resources, this device is suitable where integration, predictable power/thermal characteristics and family-level platform features are important.

Request a quote or submit a pricing inquiry to check availability and integrate the XC2VP30-5FGG676I into your next design.